497 Control Systems Engineer jobs in Singapore

Requirements

• Bachelor of Science (or equivalent degree) in Control System or instrumentation or electronic and communication or electrical engineering from an accredited university with minimum 15 years relevant experience in LNG & oil/gas projects.
• Must have minimum 5 years in similar lead role in major LNG and oil/gas projects. (experience in LNG and oil & gas projects is mandatory)
• Fully familiar with Singapore codes and international codes, standards, and recommended practices to be adopted during EPC phases of LNG & Oil/gas projects.
• Thorough knowledge of ICSS (DCS, ESD, F&G) systems and system interfaces, generally incorporated in major oil/gas project is essential.
• Must be a Functional Certified Engineer
• Must have the capacity to supervise, manage and deliver the development of engineering deliverables.
• Familiarity with subsystems. and advance process controls will be added qualification.
• Participation with contribution during P&IDs, HAZOP, and SIL reviews, shop and field testing of control systems shall be demonstrable during project execution.
• Local Singaporeans and PRs are desirable
• For foreign candidates: must currently hold valid passes in Singapore and have prior work experience in Singapore, along with relevant LNG and oil & gas project experience.

Location: Ubi/ Jurong Port

Salary: $7,000- $8,000 plus or minus (negotiable based on experience and qualifications)

This is a 2-year contract role.

A Project Engineer with Control Engineering knowledge is an individual who combines the project management skills of a Project Engineer with the technical expertise of a Control Engineer. He is responsible for overseeing engineering projects while also ensuring the proper design, implementation, and maintenance of control systems that automate and manage equipment or processes. This role is crucial in our manufacturing plant, where complex systems require both project oversight and specialized control system knowledge.

Project Management:

• Assist Project Manager to plan overall schedule and tracking and prioritize job card sequence and methodology according to contractual requirements and onboard vessel/site condition.
• Lead, manage and supervise project team on the execution of works as well as ensuring the delivery of assigned projects within the planned schedule.
• Direct and plan sufficient resources of manpower, material, and equipment for the project team for meeting the targets according to contractual requirements.
• Attend daily coordination meetings with contractor and review on progress.
• Attend or chair meetings with contractors, vendors for work scope clarification, permits to work systems compliance, schedule updates, working methodology planning, and any other contractual matters as required.
• Any other associated tasks and responsibilities assigned from time to time by the organization.

Control Systems Expertise:

• Designing, developing, and implementing control systems for automated processes, including Programmable Logic Controllers (PLCs), Distributed Control Systems (DCS), and Human-Machine Interfaces (HMIs).
• Ensuring that various components of a control system work together seamlessly and integrate with other systems within the project.
• Diagnosing and resolving issues with control systems, providing technical support, and ensuring systems are maintained for optimal performance.

Documentation and Reporting:

• Creating and maintaining technical documentation, including specifications, drawings, and reports, and providing regular updates on project status.

Team Leadership:

• Guiding and mentoring engineering teams, providing technical guidance, and fostering collaboration.

Safety and Compliance:

Ensuring that control systems are designed and operated in accordance with safety regulations and industry standards.

• A bachelor's degree in electrical engineering, mechanical engineering, or a related field is typically required
• Control Systems Knowledge: Strong understanding of control systems principles, including feedback control, automation, and instrumentation.
• Project Management Skills: Experience in project planning, scheduling, budgeting, and risk management.
• Technical Skills: Proficiency in relevant software and tools, such as AutoCAD, PLC programming languages (Ladder Logic, Structured Text), and simulation software.
• Communication and Interpersonal Skills: Ability to effectively communicate technical information to both technical and non-technical audiences.
• Problem-Solving and Analytical Skills: Ability to diagnose and resolve complex technical problems.

• Monday – Friday
• 9am – 6pm
• Ubi
• $ 3,500 – $ 4,500
• Industry: Intelligent Sensor Technology, Lighting and Automation Systems

Responsibilities:

• Lead project teams in the design and deployment of lighting control systems for residential, commercial, and hospitality sectors.
• Coordinate with architects, designers, and other engineers to ensure project requirements are met.
• Ensure timely and accurate completion of projects, from initial planning to system commissioning.
• Manage budgets, schedules, and client communications throughout the project lifecycle.
• Provide technical support and troubleshooting throughout the installation and commissioning phases.

Requirements:

• At least 1 year of experience working with lighting control systems and smart building technologies.
• Strong project management skills, including budgeting, scheduling, and vendor management.

Chin See Min Reg No. : R

The Supreme HR Advisory Pte Ltd EA No. : 14C7279

Position Summary:

The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton bonding force, and tight temperature regulation.

Key Responsibilities:

• Architect and implement real-time motion control software for multi-axis (X, Y, θ, Z) precision systems.
• Develop closed-loop PID and adaptive control algorithms for force, height, and thermal control subsystems.
• Integrate temperature, displacement, and force feedback loops for nanometer-level repeatability.
• Design software interfaces for heater ramp-up and dwell control (±5 °C accuracy).
• Collaborate with mechatronics and EE teams to synchronize control timing across motion, force, and temperature domains.
• Optimize bond process cycles using advanced motion trajectories and event synchronization.
• Develop diagnostic and calibration routines for alignment, tilt, and Z-force verification.
• Implement data logging and predictive diagnostics for machine health and precision drift.

Required Qualifications:

• Bachelor's or Master's in Computer Engineering, Control Systems, or Mechatronics
• 5+ years of experience in real-time motion or robotic control.
• Expertise in C/C++, Python, and IEC PLC programming (TwinCAT, Codesys, or similar).
• Experience with EtherCAT-based motion systems and real-time operating systems (RTOS).
• Strong understanding of multi-axis kinematics and control loop tuning.

Preferred Qualifications:

• Experience in semiconductor assembly equipment software.
• Familiarity with dSPACE, Speedgoat, or National Instruments (NI) CompactRIO platforms.
• Experience with Beckhoff TwinCAT 3, ACS Motion Control SPiiPlus, or Delta Tau PMAC control architectures.

Job Summary

If you are a looking to expand your career in the Process Control Systems space, Emerson has an excellent opportunity for you We are seeking a Senior / Field System Engineer (Process Control Systems) (DCS/PLC) who shall participate in the hardware and software configuration, programming, installation, testing and commissioning of Distributed Control Systems (DCS) including interfacing systems. You will support the system at site including performing troubleshooting, carrying out maintenance activities, providing technical support and recommendations, and participating in upgrade activities.

If this sounds like a good fit, we are eager to hear from you

In This Role, Your Responsibilities Will Be:

• Assist in software installation, configuration, programming and testing and hardware set up for small to medium-sized DCS and other project-related systems.
• Coordinate with 3rd party vendors for interface to their system(s).
• Participate in site installation and site commissioning.
• Prepare and participates in Factory Acceptance Testing (FAT) and Site Acceptance Test (SAT).
• Prepare and update engineering documentation and records, and/or liaise with relevant parties to ready it.
• Provide site service at Singapore-based facilities to maintain existing "live" systems (reactive and preventive), diagnose issues, and recommend technical solutions.
• Disseminate safety and/or relevant notices to update System as part of service support.
• Lead and facilitate renewal of software licenses.
• Generate standard service reports and facilitate provision of customized reports where required.
• Align with Sales team's objectives and provide sales support such as preparation of repair and upgrade estimations, assist in technical clarifications and conduct of demo/testing at customer's site when required.
• Uphold service level to meet and exceed customers' expectations.
• Align with the safety practices and procedures of the company.
• Assist co-workers where required or assigned by supervisors.

Who You Are:

You gain insight into customer needs. You identify and seize new opportunities. You anticipate future trends and implications accurately.

For This Role, You Will Need:

• Degree/Diploma in Computer Science, Information Systems or Engineering (in Electrical, Electronics, Chemical, Mechanical or Control subject areas).
• At least 3 years of relevant experience preferred, but those without work experience may also apply.
• Experience with Programmable Logic Controllers (PLC) is an advantage.
• A collaborative spirit with excellent problem-solving abilities.
• Self-motivated with good time management and willing to learn.
• Proficient in verbal and written English for effective communication.

Our Culture & Commitment to You:

At Emerson, we prioritize a workplace where every employee is valued, respected, and empowered to grow. We foster an environment that encourages innovation, collaboration, and diverse perspectives—because we know that great ideas come from great teams. Our commitment to ongoing career development and growing an inclusive culture ensures you have the support to thrive. Whether through mentorship, training, or leadership opportunities, we invest in your success so you can make a lasting impact. We believe diverse teams, working together are key to driving growth and delivering business results.

We recognize the importance of employee wellbeing. We prioritize providing competitive benefits plans, a variety of medical insurance plans, Employee Assistance Program, employee resource groups, recognition, and much more. Our culture offers flexible time off plans, including paid parental leave (maternal and paternal), vacation and holiday leave.

WHY EMERSON

Our Commitment to Our People

At Emerson, we are motivated by a spirit of collaboration that helps our diverse, multicultural teams across the world drive innovation that makes the world healthier, safer, smarter, and more sustainable. And we want you to join us in our bold aspiration.

We have built an engaged community of inquisitive, dedicated people who thrive knowing they are welcomed, trusted, celebrated, and empowered to solve the world's most complex problems — for our customers, our communities, and the planet. You'll contribute to this vital work while further developing your skills through our award-winning employee development programs. We are a proud corporate citizen in every city where we operate and are committed to our people, our communities, and the world at large. We take this responsibility seriously and strive to make a positive impact through every endeavor.

At Emerson, you'll see firsthand that our people are at the center of everything we do. So, let's go. Let's think differently. Learn, collaborate, and grow. Seek opportunity. Push boundaries. Be empowered to make things better. Speed up to break through. Let's go, together.

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ABOUT EMERSON

Emerson is a global leader in automation technology and software. Through our deep domain expertise and legacy of flawless execution, Emerson helps customers in critical industries like life sciences, energy, power and renewables, chemical and advanced factory automation operate more sustainably while improving productivity, energy security and reliability.

With global operations and a comprehensive portfolio of software and technology, we are helping companies implement digital transformation to measurably improve their operations, conserve valuable resources and enhance their safety.

We offer equitable opportunities, celebrate diversity, and embrace challenges with confidence that, together, we can make an impact across a broad spectrum of countries and industries. Whether you're an established professional looking for a career change, an undergraduate student exploring possibilities, or a recent graduate with an advanced degree, you'll find your chance to make a difference with Emerson. Join our team – let's go

No calls or agencies please.

Position title : TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging . The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems . The position requires cross-functional collaboration to ensure process stability, safety, and performance.

Key Responsibilities

• Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments.
• Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility.
• Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding.
• Integrate gas handling, exhaust, and pressure control modules within bonder chambers.
• Ensure compliance with cleanroom standards and contamination control requirements.
• Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding.
• Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures.
• Develop safety interlocks and control schemes for handling flammable or corrosive gases.
• Collaborate with process, equipment, and controls engineers to align designs with process needs.
• Support installation, commissioning, and troubleshooting at customer or manufacturing sites.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering or related discipline.
• Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Experience with plasma cleaning or surface activation systems.
• Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL).
• Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques.
• Familiarity with TCB, CoWoS, or hybrid bonding environments preferred.
• Experience with mass flow controller (MFC) calibration and integration.
• Knowledge of oxidation kinetics and surface chemistry in bonding processes.
• Familiarity with automation and control systems (PLC, sensors, feedback loops).
• Experience with cleanroom mechanical design and safety certifications.

Interested applicants, WA your resume to ‪‪ ‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging. The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems. The position requires cross-functional collaboration to ensure process stability, safety, and performance.

Key Responsibilities

• Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments.
• Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility.
• Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding.
• Integrate gas handling, exhaust, and pressure control modules within bonder chambers.
• Ensure compliance with cleanroom standards and contamination control requirements.
• Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding.
• Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures.
• Develop safety interlocks and control schemes for handling flammable or corrosive gases.
• Collaborate with process, equipment, and controls engineers to align designs with process needs.
• Support installation, commissioning, and troubleshooting at customer or manufacturing sites.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering or related discipline.
• Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Experience with plasma cleaning or surface activation systems.
• Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL).
• Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques.
• Familiarity with TCB, CoWoS, or hybrid bonding environments preferred.
• Experience with mass flow controller (MFC) calibration and integration.
• Knowledge of oxidation kinetics and surface chemistry in bonding processes.
• Familiarity with automation and control systems (PLC, sensors, feedback loops).
• Experience with cleanroom mechanical design and safety certifications.

WhatsApp: (Shermaine)

Siah Sze Ming Reg No: R

The Supreme HR Advisory Pte Ltd EA No: 14C7279

• TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems
• Location: Admiralty
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary : $6000 - $8000 (depends experience)

Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.

TAN LEE XIAN Reg No: R

The Supreme HR Advisory Pte Ltd EA No: 14C7279

Role Overview
The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging . The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems . The position requires cross-functional collaboration to ensure process stability, safety, and performance.

Key Responsibilities

• Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments.
• Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility.
• Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding.
• Integrate gas handling, exhaust, and pressure control modules within bonder chambers.
• Ensure compliance with cleanroom standards and contamination control requirements.
• Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding.
• Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures.
• Develop safety interlocks and control schemes for handling flammable or corrosive gases.
• Collaborate with process, equipment, and controls engineers to align designs with process needs.
• Support installation, commissioning, and troubleshooting at customer or manufacturing sites.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering or related discipline.
• Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Experience with plasma cleaning or surface activation systems.
• Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL).
• Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques.
• Familiarity with TCB, CoWoS, or hybrid bonding environments preferred.
• Experience with mass flow controller (MFC) calibration and integration.
• Knowledge of oxidation kinetics and surface chemistry in bonding processes.
• Familiarity with automation and control systems (PLC, sensors, feedback loops).
• Experience with cleanroom mechanical design and safety certifications.

• TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems
• Location: Admiralty
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary : $6000 - $8000 (depends experience)

Interested applicants can also send your resume to WA: (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.

TAN LEE XIAN Reg No: R

The Supreme HR Advisory Pte Ltd EA No: 14C7279

Role Overview
The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging . The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems . The position requires cross-functional collaboration to ensure process stability, safety, and performance.

Key Responsibilities

• Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments.
• Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility.
• Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding.
• Integrate gas handling, exhaust, and pressure control modules within bonder chambers.
• Ensure compliance with cleanroom standards and contamination control requirements.
• Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding.
• Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures.
• Develop safety interlocks and control schemes for handling flammable or corrosive gases.
• Collaborate with process, equipment, and controls engineers to align designs with process needs.
• Support installation, commissioning, and troubleshooting at customer or manufacturing sites.

Requirements

• Bachelor’s or Master’s degree in Mechanical Engineering or related discipline.
• Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Experience with plasma cleaning or surface activation systems.
• Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL).
• Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques.
• Familiarity with TCB, CoWoS, or hybrid bonding environments preferred.
• Experience with mass flow controller (MFC) calibration and integration.
• Knowledge of oxidation kinetics and surface chemistry in bonding processes.
• Familiarity with automation and control systems (PLC, sensors, feedback loops).
• Experience with cleanroom mechanical design and safety certifications.