144 Senior Packaging Engineer jobs in Singapore

Role & Responsibilities:

ABOUT YOUR ROLE:

As a Packaging Engineer, you will play a critical role in the design, development, testing, and implementation of packaging solutions for product portfolio. You will ensure that all packaging meets functional, aesthetic, sustainability, and regulatory requirements while optimizing cost and efficiency throughout the supply chain.

YOUR RESPONSIBILITIES WILL INCLUDE:

Include but not limited to

• Design & Development
• Develop innovative packaging solutions for new and existing products.
• Create detailed packaging specifications, CAD drawings, and prototypes.
• Select appropriate materials and technologies based on product needs and sustainability goals.
• Testing & Validation
• Conduct performance testing (e.g., drop, vibration, compression, environmental).
• Ensure compliance with industry standards (ISTA, ASTM, ISO) and regulatory requirements.
• Collaborate with quality assurance to validate packaging performance.
• Project Management
• Lead packaging development projects from concept to launch.
• Coordinate with cross-functional teams including Product Development, Marketing, Procurement, and Manufacturing.
• Manage timelines, budgets, and deliverables.
• Sustainability & Cost Optimization
• Identify opportunities to reduce packaging waste and improve recyclability.
• Analyze packaging costs and implement cost-saving initiatives without compromising quality.
• Supplier & Vendor Coordination
• Work with external packaging suppliers and manufacturers to source materials and components.
• Evaluate supplier capabilities and ensure adherence to specifications and quality standards.

WHAT WE WILL BE LOOKING FOR IN YOU:

• A creative problem-solver who can think outside the box to develop innovative packaging solutions.
• A detail-oriented professional with a strong sense of quality, precision, and compliance.
• A collaborative team player who thrives in cross-functional environments and communicates effectively.
• A self-starter who takes initiative, manages multiple priorities, and meets deadlines.
• A sustainability advocate who is passionate about reducing environmental impact through smart packaging choices.
• A continuous learner who stays updated on industry trends, materials, and technologies.

Orbit & Skyline India Pvt. Ltd. is a leading semiconductor service provider with a robust and experienced team of professionals proficient in providing our customers with unique, feature-rich solutions that help them build environmentally friendly semiconductor manufacturing. At Orbit & Skyline, our synergistic cross functional team of Mechanical, Electrical, Electronics, Software, Equipment, and process engineering is delivering end to end solutions to our customers in semiconductor equipment manufacturing space. We are partnering with our customers across the complete semiconductor value chain spectrum that includes Hardware design and development, Supply chain management, Quality management, Product Management, Reliability, Data Science, ML/AI and many more. We are enabling our customers to develop technologies and systems that alter industries by employing one of the most diverse workforces of cutting-edge engineers and technologists in the semiconductor industry. Our clientele includes prestigious IC chip manufacturers and OEMs from the United States, Asia, the Middle East, and Europe with our services being rendered to our global customers out of our head office in Mohali, India. We have offices in the United States, the Middle East, Singapore, Taiwan, Ireland, and several other locations.
Packaging Problem Assessment (RCCA): Effectively identifying and solving packaging issues.
Packaging Documentation: Creating clear and comprehensive records for packaging materials and processes.
Engineering Change Releases: Implementing approved changes in packaging design and processes.
Packaging Concepts (From Designing to Implementation): Developing and executing packaging ideas from start to finish.
Process Documentation: Recording and documenting packaging procedures for consistency and improvement.
Engaging with Suppliers for Packaging Designs: Collaborating with suppliers to create efficient and effective packaging solutions.
Maintaining Supplier Problem Records: Keeping a record of packaging-related issues with suppliers for future reference and improvement.
Eligibility Criteria:
You are where our search ends if you hold:
1-4 years of relevant experience.
Tech (Mechanical) with Post Graduate Diploma in Packaging from IIP.
Good knowledge of various packaging materials (preferably: Wooden Crates, Corrugated Fiberboard & Plastics).
Qualitative Factors that make you fit for the team:
International Shipping and Packaging Experience.
Hands-on experience in Auto-CAD or Artios CAD or NX.
Problem-solving and Adaptability.
Good oral and written communication skills.
Good analytical and critical thinking skills.
Good to have:
Knowledge of Email management in Outlook, MS Excel, MS PowerPoint, and MS Teams.
NX-CAD, Creo.
Understanding the voice of the customer (VOC).
Why Orbit & Skyline?
Orbit & Skyline is an amalgamation of enthusiastic and experienced people working on a remarkable concept, making headway in this industry. Today, the Semiconductor Industry is going through a rapid transformation, and we are proud to be playing a major role in development of the semiconductor ecosystem in India thus providing our employees a platform to grow technically and introducing them to a versatile and sprouting work horizon. We offer a holistic workplace that encourages individuals to attain their full potential. We are a team of thinkers, planners, doers, and risk-takers who work closely together and enjoy the top-notch benefits such as:
Safeguarding the health of our employees and their loved ones by providing them Health Insurance.
Encouraging healthy, motivated and a happy workforce by providing monthly Wellness Allowances.
Supporting effective and efficient communication by providing Communication Allowances.
Awarding stability & loyalty of the employees by covering them under the Gratuity act.
Providing technical advancements and interpersonal growth through periodic Trainings.
Providing Service Award to celebrate employee’s contributions and show our gratitude for their loyalty and commitment.
Rewarding and Recognizing employee’s efforts and contributions to the company’s growth.
Encouraging enthusiasm, interaction, and motivation by organising team lunches, team outings, offsite activities, fun Fridays, festival celebrations, and other Engagement events.
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Who are we? Orbit & Skyline India Pvt. Ltd. is a leading semiconductor service provider with a robust and experienced.
Who are we? Orbit & Skyline India Pvt. Ltd. is a leading semiconductor service provider with a robust and experienced.
Who are we? Orbit & Skyline India Pvt. Ltd. is a leading semiconductor service provider with a robust and experienced.
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Role & Responsibilities:

ABOUT YOUR ROLE:

As a Packaging Engineer, you will play a critical role in the design, development, testing, and implementation of packaging solutions for product portfolio. You will ensure that all packaging meets functional, aesthetic, sustainability, and regulatory requirements while optimizing cost and efficiency throughout the supply chain.

YOUR RESPONSIBILITIES WILL INCLUDE:

Include but not limited to

• Design & Development
• Develop innovative packaging solutions for new and existing products.
• Create detailed packaging specifications, CAD drawings, and prototypes.
• Select appropriate materials and technologies based on product needs and sustainability goals.
• Testing & Validation
• Conduct performance testing (e.g., drop, vibration, compression, environmental).
• Ensure compliance with industry standards (ISTA, ASTM, ISO) and regulatory requirements.
• Collaborate with quality assurance to validate packaging performance.
• Project Management
• Lead packaging development projects from concept to launch.
• Coordinate with cross-functional teams including Product Development, Marketing, Procurement, and Manufacturing.
• Manage timelines, budgets, and deliverables.
• Sustainability & Cost Optimization
• Identify opportunities to reduce packaging waste and improve recyclability.
• Analyze packaging costs and implement cost-saving initiatives without compromising quality.
• Supplier & Vendor Coordination
• Work with external packaging suppliers and manufacturers to source materials and components.
• Evaluate supplier capabilities and ensure adherence to specifications and quality standards.

WHAT WE WILL BE LOOKING FOR IN YOU:

• A creative problem-solver who can think outside the box to develop innovative packaging solutions.
• A detail-oriented professional with a strong sense of quality, precision, and compliance.
• A collaborative team player who thrives in cross-functional environments and communicates effectively.
• A self-starter who takes initiative, manages multiple priorities, and meets deadlines.
• A sustainability advocate who is passionate about reducing environmental impact through smart packaging choices.
• A continuous learner who stays updated on industry trends, materials, and technologies.

We are seeking a skilled Process Technologist to develop and implement advanced packaging technologies and processes for high-density, high-performance electronic devices.

• Collaborate with internal teams and external partners to design and optimize new processes.
• Provide technical support to customers on joint development projects and ensure seamless communication.
• Apply DOE methodologies to optimize process efficiency and drive continuous improvement.
• Analyze failure modes using advanced equipment to minimize waste and maximize productivity.

• Masters/Ph.D. in Material Science, Physics, or related disciplines is highly desirable.
• A minimum of 3-5 years of experience in semiconductor process development is essential.
• Hands-on expertise with DOE tools, analytical instruments, and semiconductor assembly equipment is necessary.

Please submit your updated resume via the application link below.
Only shortlisted candidates will be notified.

StaffKing Pte Ltd | Stanley Chin

As a Packaging Design Engineer, you will play a pivotal role in developing and optimizing complex packaging designs to meet product and manufacturing requirements.

The ideal candidate will have a strong background in mechanical engineering or a related field, with proficiency in 3D CAD modeling software such as Solidworks. Experience with finite element analysis using Ansys is also desirable.

You will be responsible for creating packaging solutions that are cost-effective, sustainable, and protective of products during shipping and storage. This includes designing and testing packaging materials, tools, and processes to ensure compliance with industry standards.

In addition to your technical expertise, you will need excellent communication and project management skills to work effectively with cross-functional teams and stakeholders.

We are looking for a self-motivated and detail-oriented individual who can thrive in a fast-paced environment and prioritize multiple tasks and deadlines. If you have a passion for innovative packaging design and a desire to make a meaningful contribution to our organization, we encourage you to apply.

• Key Responsibilities:
• Develop and optimize complex packaging designs to meet product and manufacturing requirements
• Create packaging solutions that are cost-effective, sustainable, and protective of products
• Design and test packaging materials, tools, and processes to ensure compliance with industry standards
• Collaborate with cross-functional teams and stakeholders to achieve project goals

• Required Skills and Qualifications:
• Bachelor's degree in mechanical engineering or a related field
• Proficiency in 3D CAD modeling software (e.g. Solidworks)
• Experience with finite element analysis using Ansys (desired)
• Excellent communication and project management skills
• Self-motivation and attention to detail

A Thermo Compression Bonding Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging.

• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

• Thermal & Mechanical Analysis Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.

Unlock Your Potential in Advanced Packaging Integration Engineering

Micron is a leader in transforming the world's use of information to enrich life for all. Our relentless pursuit of innovation enables high value technology driven solutions for customers and partners.

The solutions we create make everyday experiences like virtual reality and breakthroughs in supercomputing and artificial intelligence possible. We achieve this while upholding integrity, sustainability, and giving back to our communities.

Artificial intelligence (AI) is anticipated to become an integral component of daily life. This proliferation is fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations.

Our Advanced Packaging Technology Development team is responsible for delivering package development for high performance memory products and transferring them to manufacturing.

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Integrate semiconductors while partnering with process and product engineering teams

• Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
• Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements

• Ensure defense coverage through process, measurement, inspection, and testing
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

• Work closely with internal and external partners to build and implement technology development strategies aligned with organizational and business objectives
• Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

• Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Materials Science, or other related technical fields
• Experiences in semiconductor process integration are advantageous
• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering teams
• Ability to resolve complex issues through root-cause or model-based problem solving
• Tenacity to work effectively under timelines and limited resources
• Consistent track record of solving problems and addressing root causes
• Good communication skills
• Keen interest in the semiconductor industry
• Showcase leadership potential

As a member of our team, you will have the opportunity to contribute to groundbreaking innovations that shape the future of the industry.

At Micron, we foster a culture of collaboration, innovation, and continuous learning. We offer competitive compensation packages, comprehensive benefits, and opportunities for growth and development.

Join us in shaping the future of the semiconductor industry!

• Works in conjunction with sales managers and customer service personnel in all technical aspects of the customers' engagements.
• Responsible for first-level technical customer support, aids in developing account strategy and aligns customer needs with company's capabilities.
• Communicates and manage all customer process and package roadmap strategies.
• Coordinates factory/customer technical projects and is the point of contact for new quality/reliability programs.
• Communicates new customer technology requirements to appropriate Business Units.
• Provides technical support to sales managers and rest of sales team to gain market share and improve customer's profitability status.
• Develops, deliver technical presentations and design generation.
• Implements change notices, resolves technical issues.
• Prepares and participate in audits and factory visits with customers.

• Bachelor Degree in Engineering.
• With at least 5 - 7 years of relevant working experience in the assembly process of the back-end of semiconductor production.
• Possess good knowledge and hands-on experience in assembly processes especially in wire bonding.
• Knowledge on DOE, reliability requirements, material selection, FMEA, Failure Analysis and other quality and statistical tools.
• Self-driven and has excellent problem resolution and organizational skills for daily customer support and managing on-going and future programs.
• Relevant technical experience within the semiconductor industry.
• Has initiative and demonstrate excellent follow-up on active programs with multiple customers
• Able to communicate and present effectively in small and large groups.
• Able to work independently and as a team player with customers and world-wide cross-functional teams within the organization.
• Able and willing to travel as needed.

Key Responsibilities:

You will be responsible for providing technical support and process development to ensure the organization's goals are met.

• Technical Support and Process Development : Understand customer requirements, provide assistance to customer service related to products, and collaborate with cross-functional teams.
• Cost Estimation and Quotation : Prepare estimates based on customer specifications and drawings, generate quotations, and follow up on sales leads.
• Engineering and Technical Support : Assist sales personnel, respond to enquiries, and lead the design for manufacturability process.
• New Material Support : Participate in sourcing and developing new materials to meet technical requirements.
• Training and Knowledge Sharing : Train engineers and operators, share knowledge, and support training and marketing materials.
• Global Consistency and Best Practices : Ensure global consistency with printing and converting processes, liaise with sister sites, and attend trade shows.
• Compliance and Quality : Ensure compliance to QMS, EHS, and L&E procedures, and manage programs such as UL/CSA, RoSH, Reach, etc.

Requirements:

• Degree or diploma in a relevant field, preferably in printing, material converting, or its supply chain.
• Creative mindset and positive approach to problem-solving.
• Strong communication and presentation skills.
• Candidate with material and material science knowledge preferred.
• Familiarity with basic productivity software and AutoCAD is advantageous.
• Able to work in a laboratory-based or cleanroom environment.

About This Role:

This role offers an opportunity to contribute to the success of our organization by providing expert technical support and process development. If you have a passion for solving complex problems and improving processes, we encourage you to apply.