799 Senior Packaging Engineer jobs in Singapore

Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A LAB Process Engineer is responsible for developing, optimizing, and maintaining
laser bonding processes —especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities
Process Development & Optimization:
Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
Scale-Up & Qualification:
Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
Equipment & Program Management:
Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
Troubleshooting & Support:
Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
Continuous Improvement:
Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
Documentation:
Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
Cross-Functional Collaboration:
Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
Safety & Compliance:
Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
Customer & Project Support:
Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
Laser Maintenance & Calibration (Good-to-have):
Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.
Requirements
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
Experience with
Laser Assisted bonding technologies
is highly preferred. Familiarity with laser or optical systems is necessary.
Familiarity with
bonding equipment and analytical tools
(X-ray, SAM, OM, etc.)
Familiarity with advanced process control and manufacturing best practices
Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of
bonding process and materials behaviour under thermal/mechanical stress
(e.g., CTE mismatch, flux residue, underfill cure).
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Interested applicants, WA your resume to or email your resume to
TAN YEN ZHEN (CHEN YANZHEN) REG NO: R
THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C727
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Position title : Laser-Assisted Bonder (LAB) process engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes —especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Familiarity with advanced process control and manufacturing best practices
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to ‪‪ ‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C727

Job Description

• Skilled in automated chemical surface treatment and equipment operation, including managing all etching consumables, jigs, and fixtures.
• Hands-on experience with industrial processes like copper/nickel plating, plastic plating, and aluminum oxidation or chemical conversion.
• Ability to execute production tasks according to Standard Operating Procedures (SOPs) and Standard Inspection Procedures (SIPs) in a mass production environment.
• On-site troubleshooting and resolution of issues within the etching process

Requirements

• EHS Knowledge: An understanding of the balance between process development and Environmental, Health, and Safety (EHS) requirements.
• Technical Proficiency: Skilled in composition, principles, and safety requirements of chemical surface treatment equipment and chemicals. Proficient in using related chemical inspection equipment and reagents.
• Soft Skills: Must be proactive and possess communication and coordination abilities to work effectively with upstream and downstream teams.

We regret that only shortlisted candidates will be notified.

Name: Tan Ee Shuan

Registration No.: R

EA License No.: 02C3423

Process Engineer (Manufacturing Engineer)
Join to apply for the
Process Engineer (Manufacturing Engineer)
role at
Jabil
Process Engineer (Manufacturing Engineer)
Join to apply for the
Process Engineer (Manufacturing Engineer)
role at
Jabil
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Summary
We are seeking a highly skilled and detail-oriented
Summary
We are seeking a highly skilled and detail-oriented
Process Engineer
to develop, optimize, and maintain surface mount assembly processes for printed circuit board assemblies (PCBA). The ideal candidate will ensure high-yield, low-defect production by improving process capability, equipment utilization, and quality assurance.
ESSENTIAL DUTIES AND RESPONSIBILITIES include the following. Other duties may be assigned.
Develop and maintain SMT assembly processes (screen printing, pick-and-place, reflow soldering, Wave, SPI).
Analyze and improve process capability (Cp, Cpk), first pass yield (FPY), and overall equipment effectiveness (OEE).
Define, monitor, and optimize reflow oven thermal profiles for lead and lead-free soldering.
Drive root cause analysis and corrective actions for process defects (e.g., tombstoning, solder bridging, head-in-pillow).
Support New Product Introductions (NPI) by establishing process flows, documentation, and line setup.
Perform DFM/DFT reviews with design and test engineering teams.
Create and update standard operating procedures (SOPs), work instructions, and training materials.
Work closely with cross-functional teams including quality, production, R&D, and equipment engineering.
Ensure compliance with IPC-A-610, J-STD-001, ESD, and other industry standards.
Minimum Requirements
Bachelor's degree in Electronics, Mechanical, Mechatronics, or Industrial Engineering (or related field).
4–6+ years’ experience in SMT or PCBA manufacturing environment.
Strong knowledge of
SMT machines.
Well verse on ISO - Medical requirements. (Will be advantage)
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Seniority level
Seniority level Mid-Senior level
Employment type
Employment type Full-time
Job function
Job function Management and Manufacturing
Industries Appliances, Electrical, and Electronics Manufacturing
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Location: Shugart, SG
Posting Date: Sep 16, 2025
Job ID: 12587
About our group:
The Global Packaging Engineering team provides innovative, cost-effective, and sustainable packaging and in-process tray/carrier (automated and manual) solutions that involve the STX supply chain and transportation, holistically for Strategic Trade Solutions (STX) operation and environment. Our designed mechanical/packaging part contributes to STX product shipment quality and manufacturing from Slider to finished HDD, including the packaging that ships products to customers.
About the role - you will:
The Global Packaging Engineer role at Seagate involves developing and optimizing complex packaging designs and testing to meet product and manufacturing requirements, focusing on cost-effective, sustainable, and protective solutions for HDD products. Candidates should have a mechanical or packaging engineering degree, proficiency in English, 3D CAD modeling skills, and experience with packaging materials and testing standards, with additional knowledge in finite element analysis, Six Sigma, and HDD manufacturing preferred; the position is based in Woodland, Singapore, with 35% travel expected.
Develops complex package design and testing criteria to meet established requirements and maintains oversight/streamlining of existing packaging.
Develops recommendations according to the nature of the product, STX manufacturing requirements/changes, cost considerations, and the type of protection required (distribution, moisture, chemicals/cleanliness, ESD, automation, and compliance requirements).
Generate and document packaging drawings, BOM, SAP, packaging instructions, and maintain their congruency across STX factories.
Develop/generate flexible packaging solutions and document label guides.
Responsible for supporting Marketing and secondary contract packaging sites, including documentation management and test reports as well as change approval.
About you:
Bachelor's Degree in Mechanical Engineering or Logistics/Supply Chain Management.
Efficiently multitasks, being self-driven, and paying attention to details. Understands with whom to interact to make progress (supplier contacts, factory, CMT, purchasing, supplier quality, and other engineering groups).
Fluent in English communication both spoken and written.
Ability to speak mandarin to liase with chinese suppliers.
Your experience includes:
Capability to work cross-functionally is preferred.
3D CAD modeling experience with Solidworks or similar is a must, and GD&T.
Finite element analysis experience using Ansys is a plus.
Expanded foam cushion and pallet design hands-on are preferred, and experience with thermoform, injection-molded plastic is a plus.
Package design, tooling design, and test experience, including familiarity with packaging-related ASTM and ISTA test standards, desired.
Data analysis of large datasets.
You might also have:
Knowledge of global compliance requirements and trends is an added advantage.
HDD manufacturing industry knowledge.
Familiar with plastic and expanded foam cushion materials (e.g. EPP, EPE).
Familiar with corrugated fiberboard materials and their specifications.
Knowledge/experience using electrodynamic vibration tester, accelerometers for measuring shock levels on the Lansmont Test Partner system.
Location:
About Us
With more than four decades of storage innovation, Seagate empowers humanity to thrive in the data age and helps people and businesses navigate the ever-expanding data landscape.
We craft precision-engineered, cutting-edge solutions that help the world store and manage exponential data growth.
Seagate is powered by our talented andpassionate workforce of 29,000 employees across the globe who embody our core values: integrity, innovation, and inclusion. Striving towards excellence every single day, we show up with these values for our customers, business partners, shareholders, and communities alike.
Join us and get inspired to make a difference in the datasphere!
Seagate is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, race, color, ancestry, national origin, citizenship status, physical or mental disability, genetic information, marital status, sex (which includes pregnancy, childbirth, breastfeeding, or related medical conditions), gender, gender identity, gender expression, sexual orientation, religion, military and veteran status, or other status protected by applicable law. We will consider for employment qualified applicants with arrest and conviction records. EEO Know Your Rights Poster
Seagate will provide reasonable accommodationwith the application process upon request as required to comply with applicable laws. If you need assistance oraccommodation due to a disability, you may contact us at
All Seagate jobs will remain open for a minimum of seven days.
For information on how Seagate collects and uses your personal information during the application process, please review the Applicant Privacy Statement .
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