1,205 Semiconductor Design jobs in Singapore

6723 - Semiconductor Equipment Design Engineer – TCB

Singapore, Singapore THE SUPREME HR ADVISORY PTE. LTD.

Posted 4 days ago

Job Viewed

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Job Description

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

  • Design & Development
    Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
    Oversee fabrication of prototype modules and their integration with TCB platforms.
    Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
    Document all designs, simulations, and test results according to quality management and IP standards.
    Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis
    Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
    Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
    Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

WhatsApp: +65 9642 0989 (Han)

Email:

Chaw Chiaw Han, Reg No:R22106723

The Supreme HR Advisory Pte Ltd, EA No:14c7279

#J-18808-Ljbffr
This advertiser has chosen not to accept applicants from your region.

6723 - Semiconductor Equipment Design Engineer - TCB

Singapore, Singapore THE SUPREME HR ADVISORY PTE. LTD.

Posted today

Job Viewed

Tap Again To Close

Job Description

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

  • Design & Development
    Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
    Oversee fabrication of prototype modules and their integration with TCB platforms.
    Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
    Document all designs, simulations, and test results according to quality management and IP standards.
    Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis
    Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
    Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
    Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

WhatsApp: +65 9642 0989 (Han)

Email:

Chaw Chiaw Han, Reg No:R22106723

The Supreme HR Advisory Pte Ltd, EA No:14c7279

#J-18808-Ljbffr

This advertiser has chosen not to accept applicants from your region.

Technologist for Advanced Semiconductor Equipment Design

Singapore, Singapore beBeeTCB

Posted today

Job Viewed

Tap Again To Close

Job Description

Tech Innovator Job

">
    ", "Job Description:

    As a talented professional, you will design and develop advanced TCB (Thermo Compression Bonding) equipment used in semiconductor packaging. Your key responsibility will be to create innovative module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding. You will oversee the fabrication of prototype modules and their integration with TCB platforms. Additionally, you will collaborate with electrical, vision, and software engineers for machine integration. Your work will involve analyzing test results, identifying design improvements, and troubleshooting failures related to temperature non-uniformity, inefficiency, or material degradation.", "Required Skills & Qualifications:

    Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field is necessary. A minimum of 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging or advanced interconnect processes is required. Proficiency in 3D/2D CAD knowledge, preferably with experience in CREO Parametric, is essential. Familiarity with bonding equipment and analytical tools is also desired.", "Benefits & Perks:

    We offer a dynamic and supportive work environment. If you are passionate about innovation and technology, we encourage you to apply.

    ",
This advertiser has chosen not to accept applicants from your region.

6723 - Semiconductor Equipment Design Engineer - TCB

Singapore, Singapore THE SUPREME HR ADVISORY PTE. LTD.

Posted today

Job Viewed

Tap Again To Close

Job Description

Position title : TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:
Design & Development
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Prototyping & Testing
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
Compliance & Documentation
Document all designs, simulations, and test results according to quality management and IP standards.
Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Good-to-have:
Thermal & Mechanical Analysis
Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
Mounting of the heater assembly for micron-level Z positioning and planarity during operation.
Requirements
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
Experience with TCB or Laser Assisted bonding technologies is highly preferred.
Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
WhatsApp: +65 9642 0989 (Han)
Email:
Chaw Chiaw Han, Reg No:R22106723
The Supreme HR Advisory Pte Ltd, EA No:14c7279
#J-18808-Ljbffr

This advertiser has chosen not to accept applicants from your region.

6723 - Semiconductor Equipment Design Engineer – TCB

068805 Shenton Way, Singapore $8000 Monthly THE SUPREME HR ADVISORY PTE. LTD.

Posted 6 days ago

Job Viewed

Tap Again To Close

Job Description

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)


Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.


Key Responsibilities

Must-have:

  • Design & Development
    Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
    Oversee fabrication of prototype modules and their integration with TCB platforms.
    Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
    Document all designs, simulations, and test results according to quality management and IP standards.
    Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis
    Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
    Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
    Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus




WhatsApp: +65 9642 0989 (Han)

Email:

Chaw Chiaw Han, Reg No:R22106723

The Supreme HR Advisory Pte Ltd, EA No:14c7279

This advertiser has chosen not to accept applicants from your region.

Semiconductor Facility Mechanical Design Specialist

Singapore, Singapore beBeeMechanical

Posted today

Job Viewed

Tap Again To Close

Job Description

Job Overview

We are seeking a skilled and detail-oriented Mechanical Engineer to join our team in the semiconductor facility.

Responsibilities:
  • Conduct site inspections, prepare construction material estimation forms, and create construction drawings.
  • Communicate and coordinate with clients and contractors, discussing piping installation paths, project progress, and construction specifications.
  • Verify UHP gas piping construction materials and drawings, assisting in controlling the quality and progress of piping work according to client specifications.
  • Complete daily supervision reports and consolidate acceptance reports.
  • Perform QC testing on UHP gas piping systems using specialized tools and analysis instruments.
  • Execute professional QC testing procedures and make professional judgments based on site conditions.
  • Record gas piping QC test results and prepare testing reports.
  • Cary out tasks assigned by supervisors.
Requirements:
  • Necessary Requirements
  • Education: High school diploma or higher
  • Language: Proficient in Chinese and English communication
  • Computer Skills: Proficient in typing in Chinese/English, familiar with Microsoft Office (Word, Excel)
  • Work Attitude: Proactive and eager to learn; no prior related work experience required, but experience in a technology manufacturing environment in Singapore is preferred.
This advertiser has chosen not to accept applicants from your region.

Semiconductor Digital IC Design Specialist

Singapore, Singapore beBeeHardwareExpert

Posted today

Job Viewed

Tap Again To Close

Job Description

Job Overview

">

We are seeking an experienced semiconductor digital IC design engineer to join our team. The ideal candidate will have a strong background in ASIC design and development, with expertise in system-on-chip (SoC) timing constraint management, synthesis, and timing closure.

  • Work closely with system engineers to ensure timely delivery of projects, providing feedback on optimization opportunities.
  • Develop and implement effective power structures, including isolation of power domains and level-shifter crossing voltage domains.
  • Conduct formal verification to compare release versions and identify areas for improvement.
  • SUPPORT THE BACK-END IMPLEMENTATION TEAM IN TIMING VIOLATION ANALYSIS AND FIXES.
  • Support the insertion and optimization of scan elements.
  • Collaborate with the power structure team to optimize power consumption.

Requirements

">

To succeed in this role, you will need:

  • A Bachelor's or Master's degree in Electronic Engineering with relevant ASIC design experience.
  • Familiarity with the ASIC design flow and tools.
  • Strong understanding of logic synthesis, static timing analysis, and timing closure techniques.
  • Good knowledge of Design-for-Test (DFT) and power structure principles.
  • Experience working in a UNIX/Linux environment and proficiency in scripting languages.
  • Excellent communication and interpersonal skills.
  • Strong analytical and problem-solving skills.

What We Offer

">

In addition to a competitive salary and benefits package, we offer a dynamic and supportive work environment that fosters growth and development.

"
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Semiconductor Packaging Design Engineer (Thermal-Compression Bonding / TCB) - 8890

Singapore, Singapore THE SUPREME HR ADVISORY PTE. LTD.

Posted today

Job Viewed

Tap Again To Close

Job Description

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

  • Design & Development
    Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
    Oversee fabrication of prototype modules and their integration with TCB platforms.
    Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
    Document all designs, simulations, and test results according to quality management and IP standards.
    Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis
    Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
    Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
    Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested Personal kindly contact WhatsApp :+65 8833 7969(Lydia)

OR

Email to :

The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279

#J-18808-Ljbffr
This advertiser has chosen not to accept applicants from your region.

Semiconductor Packaging Design Engineer (Thermal-Compression Bonding / TCB) - 8890

068805 Shenton Way, Singapore $8000 Monthly THE SUPREME HR ADVISORY PTE. LTD.

Posted 3 days ago

Job Viewed

Tap Again To Close

Job Description

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)


Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.


Key Responsibilities

Must-have:

  • Design & Development
    Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
    Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
    Planning, Scheduling and Costing of Machines Modules.
  • Prototyping & Testing
    Oversee fabrication of prototype modules and their integration with TCB platforms.
    Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
  • Process & Manufacturing Support
    Collaborate with Electrical, Vision and Software Engineers for the machine integration.
    Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
    Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
    Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
  • Compliance & Documentation
    Document all designs, simulations, and test results according to quality management and IP standards.
    Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

  • Thermal & Mechanical Analysis
    Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
    Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
    Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

  • Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
  • Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
  • 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
  • Experience with TCB or Laser Assisted bonding technologies is highly preferred.
  • Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
  • Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
  • Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
  • Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
  • Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus


Interested Personal kindly contact WhatsApp :+65 8833 7969(Lydia)

OR

Email to :

The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279

This advertiser has chosen not to accept applicants from your region.

Electrical Engineer / Senior Electrical Engineer

737663 $5000 Monthly CAPCON SINGAPORE PTE. LTD.

Posted 11 days ago

Job Viewed

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Job Description

Job Description

• Develop control solution related to Semiconductor equipment.

• Design electrical system includes interlock, power distribution, digital/analog signal, I/O, etc

• Manage external vendors or contractors to deliver sub-systems that meet design specification and reliability

• Responsible for equipment safety, manage equipment compliance and certification on standards such as SEMI, CE, etc

• Integrate and test subsystems


Job Requirement

• Bachelor’s Degree in Electrical Engineering or equivalent, with at least 3 years working experience in electrical system design.

• Familiar with AC & DC application, motors, sensors, etc

• Experience in semiconductor equipment industry or high precision automation equipment industry is advantageous.

• Familiar with communication protocol, such as Ethernet, RS232, etc

• Strong diagnostic skills and capable of resolving electrical noise, grounding, and signal integrity issues

• Experience in Electrical CAD tools

• Knowledge of automation and control loops

• Knowledge of designing and documenting cables

• Experience in safety and electrical regulatory compliance such as SEMI, CE, etc

• Experience in PCB design is an advantage


Job Benefits

• 5 days work week

• Group Medical Insurance



Only shortlisted candidates will be notified

Starting salary depending on experience

This advertiser has chosen not to accept applicants from your region.
 

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