38 Packaging Technologist jobs in Singapore

Responsibilities

· To lead a group of sputter EAs to conduct daily sputtering work

· To develop new multilayers thin film structure for new hard disk media programs

· To duplicate hard disk media structure based on design transferred

· To monitor sputter process

Requirements

· Bachelor/ Master’s Degree in Materials Science and Engineering (Chemistry/ Physics/ Mechanical/ Electronics)

· Candidates without experience are welcome to apply.

· Sputtering-related skills in PVD, CVD process, Minitab, Microsoft excel.

To find out more about this opportunity, please contact Lionel Liew at .

We regret that only shortlisted candidates will be notified.

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Lionel Liew | Registration No: R

This is in partnership with the Employment and Employability Institute Pte Ltd (“e2i”).

e2i is the empowering network for workers and employers seeking employment and employability solutions. e2i serves as a bridge between workers and employers, connecting with workers to offer job security through job-matching, career guidance and skills upgrading services, and partnering employers to address their manpower needs through recruitment, training, and job redesign solutions. e2i is a tripartite initiative of the National Trades Union Congress set up to support nation-wide manpower and skills upgrading initiatives.

By applying for this role, you consent to GMP Technologies (S) Pte Ltd’s PDPA and e2i’s PDPA .

Overview
NTI-NTU Corporate Laboratory is a collaboration between Nanofilm Technologies International Limited (Nanofilm, NTI), Nanyang Technological University (NTU) and supported by Singapore under RIE2025. The Laboratory’s objective is to propel Innovation and Technologies commercialisation through NTU’s innovation and NTI’s deep technology. NTI-NTU Corporate Laboratory aligns with Singapore’s RIE2025 handbook, which emphasises the nation’s commitment to research and innovation to drive economic growth and address national challenges.
The Nanyang Technological University NTI-NTU Corporate Laboratory is seeking to hire a Research Fellow. The selected candidate will innovate hybridized composite materials and thin film coatings.
Responsibilities
Simulate, design, fabricate and characterize plasma process equipment.
Familiar with COMSOL software to simulate the influence of magnetic field on plasma flow.
Conduct diverse design simulations to refine processes.
Optimize vacuum coating processes, and lead R&D efforts in material science for application development.
Drive the development and implementation of coating techniques.
Oversee the transition from experimental designs to scalable solutions.
Prepare and deliver comprehensive reports to satisfy the stipulations of funding entities and corporate mandates.
Qualifications
Ph.D. in a relevant engineering or science discipline is required.
At least 2 years of combined specialized post-doctoral experience in industry or a recognized research institute.
Expertise in plasma physics, plasma source design, plasma control system design and a strong track record of research publications and patent filings are essential.
Applicants must demonstrate effective collaboration skills in multidisciplinary settings.
Hiring Institution
NTU
Seniority level
Mid-Senior level
Employment type
Full-time
Job function
Engineering and Information Technology
Industries
Higher Education
We regret that only shortlisted candidates will be notified.
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Overview
Research Fellow (Electrical and Electronic Engineering/Material Science/Physics) at Nanyang Technological University Singapore. The School of Electrical and Electronic Engineering is a founding school with a culture of excellence. It hosts over 3,000 undergraduate students and 2,000 graduate students and ranks 4th in Electrical & Electronic Engineering in the 2025 QS World University Rankings by Subjects. For details, view:
Responsibilities
Carbon Nanotubes growth, transfer and characterization
Waveguide/filters/lens device fabrication
High frequency characterization of fabricated passive devices
Work together with collaborators on waveguides design
Draft research papers for academic journals
Mentor new manpower (PhD or FYP students) if applicable
Prepare research proposals and conduct presentations at seminars
Support the school in various teaching activities, including supervising labs and tutorials
Qualifications
PhD degree in Electrical and Electronic Engineering and/or Electronic and Communication Engineering from top universities
Expertise in Carbon Nanotubes material
Experience with Carbon Nanotubes manipulation
Experience in cleanroom processes such as UV Lithography, E-Beam PVD, Sputtering, RIE, etc
At least 2 years research experience in related area
Good communication skills and the ability to work with team members and collaborators
Publication track record is an advantage
Meticulous and good with data
Self-Motivated and takes initiative
Independent and can work well with a team
Organized and detail oriented
Ability to adapt to changing priorities
Job Details
Seniority level: Mid-Senior level
Employment type: Full-time
Job function: Research, Analyst, and Information Technology
Industries: Higher Education
Hiring Institution: NTU
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The School of Chemistry, Chemical Engineering and Biotechnology is seeking for a full-time Research Fellow.
The Research Fellow will work together with R&D team to conduct the following tasks.
Key Responsibilities
Development of new machine learning modeling approaches
Development of new advanced control and optimization algorithms
Optimization of carbon capture process operation
Provide regular project updates to principal investigator and funding agency
Report writing/presentation
Job Requirements
PhD degree in an engineering field related to this project
Experience in dynamic modeling, machine learning and optimization & controls
Having basic knowledge in carbon capture, utilisation and storage (preferable)
Good command of English, both oral and written with ability to communicate effectively with a wide range of individual and professional groups
We regret that only shortlisted candidates will be notified.
Hiring Institution: NTU
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Research Fellow (Electrical and Electronic Engineering/Material Science/Physics) page is loaded# Research Fellow (Electrical and Electronic Engineering/Material Science/Physics)locations:
NTU Main Campus, Singaporetime type:
Full timeposted on:
Posted Todayjob requisition id:
R School of Electrical and Electronic Engineering is one of the founding Schools of the Nanyang Technological University. Built on a culture of excellence, the School is renowned for its high academic standards and research. With over 3,000 undergraduates students and 2,000 graduate students it is one of the largest EEE schools in the world and ranks 4th in the field of Electrical & Electronic Engineering in the 2025 QS World University Rankings by Subjects.Today, the School has become one of the world’s largest engineering schools that nurtures competent engineers and researchers. Each year, the School graduates over a thousand students who are ready to take on great ambitions and challenges.For more details, please view:We are looking for a Research Fellow (RF) who is experienced in device and microfabrication to support our research Novel Carbon Nanotube Transfer Technology. The role will be working together closely with our research team and our collaborators using the Carbon Nanotube transfer technology for the fabrication of high frequency passive devices.**Key Responsibilities:**The RF will work on a project to conduct the research on carbon-based passive devices for high frequency applications with our research team and our collaborators. The roles of this position include:* Carbon Nanotubes growth, transfer and characterization* Waveguide/filters/lens device fabrication* High frequency characterization of fabricated passive devices* Work together with collaborators on waveguides design* Draft research papers for academic journals* Mentor new manpower (PhD or FYP students) if there is any* Prepare research proposals and conduct presentations at seminars.* Support the school in various teaching activities, including instructing or supervision of labs and tutorials**Job Requirement:*** PhD degree in Electrical and Electronic Engineering and/or Electronic and Communication Engineering from top universities* Expertise in Carbon Nanotubes material* Experienced with Carbon Nanotubes manipulation* Experienced in cleanroom process such as UV Lithography, E-Beam PVD, Sputtering, RIE, etc* At least 2 years research experience in related area* Good communication skills and the ability to work with team members and collaborators* Publication track record is an advantage* Meticulous and good with data* Self-Motivated and takes initiative* Independent and can work well with a team* Organized and detail oriented* Ability to adapt to changing prioritiesWe regret to inform that only shortlisted candidates will be notified.Hiring Institution: NTUNTU is also home to world-class autonomous institutes – the National Institute of Education, S Rajaratnam School of International Studies, Earth Observatory of Singapore, and Singapore Centre for Environmental Life Sciences Engineering – and various leading research centres such as the Nanyang Environment & Water Research Institute (NEWRI) and Energy Research Institute @ NTU ( ).Ranked amongst the world’s top universities by QS, NTU has also been named the world’s top young university for the past seven years. The University’s main campus is frequently listed among the Top 15 most beautiful university campuses in the world and has 57 Green Mark-certified (equivalent to LEED-certified) buildings, of which 95% are certified Green Mark Platinum. Apart from its main campus, NTU also has a campus in Novena, Singapore’s healthcare district.Under the NTU Smart Campus vision, the University harnesses the power of digital technology and tech-enabled solutions to support better learning and living experiences, the discovery of new knowledge, and the sustainability of resources.For more information, visit
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Mafé Group owns multiple health-focused dining and functional brands, including Mafé Bento and Planté|清蔬.
We are dedicated to combining science and creativity to create dining experiences that offer nutrition, flavor, and healing.
Here, you will explore the concept of "food as medicine," from recipe development to brand presentation, and experience how food science empowers modern healthy dining.
Job Description
Assist with tasks like
Designing packaging layouts/mockups
Selecting packaging materials
Working on labels, product sleeves, or boxes
Visual presentation
Application Instructions
Please apply for this position by submitting your text CV using InternSG.
Kindly note that only shortlisted candidates will be notified.
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Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
• Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to ‪‪ ‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279

Overview
Our client, a leading multinational in the food & beverage FMCG sector, is seeking a Regional Aseptic Packaging Engineer to support its growing network of co-manufacturing partners across the APAC region. This role focuses on driving operational excellence, optimizing packaging processes, and implementing continuous improvement initiatives. The position is based in Singapore.
As an Aseptic Packaging Engineer, you will provide technical leadership in aseptic packaging operations, ensuring consistent quality, productivity, and cost optimization across manufacturing partners. You will play a critical role in troubleshooting plant issues, supporting new product launches, and developing operational best practices to strengthen manufacturing capabilities across the network.
Key Responsibilities
Provide technical support to ensure quality, productivity, and cost efficiency across packaging operations.
Build aseptic packaging operations expertise and capability within the supplier network.
Troubleshoot and resolve manufacturing-related issues to minimize downtime.
Support technical training programs and contribute to developing skill enhancement plans for packaging teams.
Partner with co-manufacturers on new packaging launches and product commercialization.
Conduct manufacturing audits and follow up on process improvement actions.
Collaborate with QA teams to investigate and resolve product quality issues.
Develop and implement preventive maintenance systems to sustain production performance.
Support and lead projects involving new plant installations, process upgrades, and continuous improvement initiatives.
Manage project timelines and ensure on-time delivery through cross-functional coordination.
Identify and execute cost optimization projects and process efficiency improvements within the manufacturing network.
Strengthen supply chain and manufacturing systems through proactive project execution.
Execute technical trials and process validations for new products and packaging technologies.
Partner with co-manufacturers on product enhancements and process optimization.
Assess the technical feasibility of new manufacturing partners and suppliers.
Drive compliance with internal manufacturing standards and ensure continuous improvement across partner sites.
Qualifications
Bachelor’s Degree in Mechanical, Food or Chemical Engineering or a related field.
Minimum 5 years experience in Tetra Pak aseptic filling operations or equivalent liquid packaging systems.
Strong understanding of low-acid aseptic beverage production and related processing constraints.
Familiarity with HACCP, GMP, and other food safety management systems.
Strong problem-solving, communication, and stakeholder management skills.
Proven ability to work collaboratively across diverse teams and cultural environments.
Willingness to travel across the region
Interested applicants are invited to
'Apply'
or send their CVs to
EA Personnel: Brian Tan
EA Reg: R
EA License: 25S3064
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Job Description
Collaborate on chip architecture: Work closely with the front-end design team to develop comprehensive chip floorplans, clock architectures, and power plans.
Lead physical design processes: Take charge of the entire physical design lifecycle, from Netlist to GDSII, ensuring high-quality outcomes at every stage.
Ensure design integrity: Conduct formal verification, static timing analysis, and physical verification to maintain the highest standards of chip design.
Optimize power consumption: Perform power analysis and implement design strategies for improved efficiency and reliability.
Drive project completion: Oversee the tapeout process, bringing designs from concept to reality.
Job Requirement
Bachelor's degree or higher in electronic engineering, microelectronics, or computer science.
Professionals with at least 3 years of hands-on experience in digital backend design, preferably with tapeout experience in advanced technology.
Individuals skilled in TCL, Perl, or Python script development, and familiar with EDA tool design will have an advantage.
HOW TO APPLY:
Interested applicants, kindly send your resume in MS WORD format to leo.tang(at)trustrecruit.com.sg
We regret only shortlisted candidates will be notified.
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Please read our privacy statement on our corporate website
Trust Recruit Pte Ltd
EA License No: 19C9950
EA Personnel: Tang For Farn (Leo)
EA Personnel Reg No: R
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