6 Packaging Solutions jobs in Singapore

TCB Design Engineer

We are seeking an experienced TCB Design Engineer to join our team. In this role, you will be responsible for designing and developing innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

• Key Responsibilities:
• Design and develop TCB modules assemblies using 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA), and Planning, Scheduling, and Costing of Machines Modules.
• Oversee the fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Collaborate with Electrical, Vision, and Software Engineers for machine integration and with process teams to improve bonding machines and manufacturing engineers to ensure safe and robust assembly of module systems.
• Support the transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Requirements:
• Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2-5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools.

We are seeking an accomplished Sales Professional to join our team in the field of Packaging Solutions.

The ideal candidate will possess strong sales skills, with a proven track record of achieving targets and growing client bases.

• Sales and Business Development: Identify new business opportunities and pursue them to achieve sales targets and expand the company's client base.
• Client Relationship Management: Build and maintain strong relationships with existing clients to ensure customer satisfaction and repeat business.
• Lead Generation: Conduct market research and actively seek out new sales opportunities through cold calling, networking, and attending industry events.
• Sales Presentations: Present the company's packaging solutions and products to prospective clients, showcasing the value and benefits.
• Negotiation and Closing: Handle negotiations with clients, close sales deals, and ensure timely follow-up on leads and opportunities.
• Account Management: Manage a portfolio of key accounts, ensuring regular contact and support for their packaging needs.
• Market Analysis: Stay updated on market trends, competitors, and customer preferences to provide relevant feedback and recommendations.
• Sales Reporting: Prepare and present regular sales reports, forecasts, and strategies to senior management.
• Collaboration: Work closely with marketing, logistics, and product development teams to ensure seamless delivery of services and customer satisfaction.

Key Qualifications:

• Diploma or Degree in Business, Sales, Marketing, or a related field.
• Minimum 2-3 years of relevant sales experience, preferably in the packaging, manufacturing, or B2B sectors.
• Familiarity with CRM software and MS Office applications.
• A valid Class 3 license and own transportation is an advantage.

Benefits:

• Competitive salary range.
• Transport and phone allowances.

Other Opportunities:

This role offers a dynamic and challenging work environment, with opportunities for professional growth and development.

Key Role Summary:

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• A leading global semiconductor company is seeking a highly skilled TCB (Thermo Compression Bonding) Design Engineer to join their team.
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This position involves the design, development, and optimization of TCB modules subsystems used in advanced semiconductor packaging. As a key member of our engineering team, you will be responsible for designing innovative solutions to meet customer requirements while ensuring precise thermal control during Chip-to-Wafer or Chip-to-Substrate bonding. This role plays a critical part in ensuring process reliability, yield, and throughput.

The successful candidate will have the following responsibilities:

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1. Design & Development: Design novel TCB module assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
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2. 3D/2D CAD Design: Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, and Design for Manufacturability and Assembly (DFMA).
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3. Prototyping & Testing: Oversee the fabrication of prototype modules and their integration with TCB platforms. Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
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4. Process & Manufacturing Support: Collaborate with Electrical, Vision, and Software Engineers for machine integration. Work with the process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls). Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
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5. Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards.
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To be considered for this position, candidates must possess:

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• Bachelor's or Master's degree: In Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
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• Minimum 2-5 years of experience: In design and development of equipment or semiconductor packaging or advanced interconnect processes.
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• 3D/2D CAD knowledge: With experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
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• Experience with TCB technologies: Highly preferred. Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
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• Excellent trouble-shooting skills: Risk analysis, FMEA, and statistical analysis (JMP, Minitab).
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• Knowledge of bonding process: And materials behavior under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
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• Experience with thermal system/component design: Heaters, sensors, thermal interfaces, including hands-on and simulation skills.
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Tan Yen Zhen
EA NO: 14C7279

Summary Benefits:

• Basic Up to $5000
• Attractive Commission Structure
• 5 Working Days, Office Hours

Responsibilities:

• Drive new business by actively prospecting, networking, and converting leads into clients.
• Manage and grow relationships with a small portfolio of existing clients provided by the company.
• Engage potential customers to understand their operational needs and recommend suitable solutions from Syspex's range of products.
• Negotiate terms, prepare proposals, and close sales contracts to consistently meet or exceed sales targets.
• Maintain a healthy sales pipeline and provide accurate sales forecasts and reports.
• Work closely with internal teams (e.g., marketing, operations) to deliver customer-centric solutions.
• Represent the company at client meetings, site visits, and industry networking events.

Requirements:

• Diploma/Degree in Business, Engineering, or a related discipline preferred.
• Proven track record in industrial sales or business development, ideally with packaging, manufacturing, or engineering solutions.
• Possess a valid Class 3 driving license and own car is an advantage.

To Apply, kindly click on the "APPLY NOW" button

We regret that only shortlisted candidates will be notified.

StaffKing Pte Ltd (20C0358) | Wei Ren Chew (R

We're seeking a skilled Software Engineer to design, implement, and test high-performance systems that support automation, control, and data processing. This role will involve close collaboration with cross-functional teams to drive innovation and enhance system performance.

• Develop software for motion control, data acquisition, and process automation.
• Work with hardware and mechanical teams to integrate precision components.
• Create real-time embedded software for high-speed, high-precision equipment.
• Test, debug, and optimize software for reliability and performance.
• Ensure compliance with cybersecurity, data integrity, and industry standards.

• Experience in software development, preferably in semiconductor or manufacturing.
• Strong C++ skills for embedded systems, automation, or UI development.
• Bonus: Knowledge of AI, ML, or computer vision in semiconductor applications.