25 Packaging Engineer jobs in Singapore

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Location: Shugart, SG
Posting Date: Sep 16, 2025
Job ID: 12587
About our group:
The Global Packaging Engineering team provides innovative, cost-effective, and sustainable packaging and in-process tray/carrier (automated and manual) solutions that involve the STX supply chain and transportation, holistically for Strategic Trade Solutions (STX) operation and environment. Our designed mechanical/packaging part contributes to STX product shipment quality and manufacturing from Slider to finished HDD, including the packaging that ships products to customers.
About the role - you will:
The Global Packaging Engineer role at Seagate involves developing and optimizing complex packaging designs and testing to meet product and manufacturing requirements, focusing on cost-effective, sustainable, and protective solutions for HDD products. Candidates should have a mechanical or packaging engineering degree, proficiency in English, 3D CAD modeling skills, and experience with packaging materials and testing standards, with additional knowledge in finite element analysis, Six Sigma, and HDD manufacturing preferred; the position is based in Woodland, Singapore, with 35% travel expected.
Develops complex package design and testing criteria to meet established requirements and maintains oversight/streamlining of existing packaging.
Develops recommendations according to the nature of the product, STX manufacturing requirements/changes, cost considerations, and the type of protection required (distribution, moisture, chemicals/cleanliness, ESD, automation, and compliance requirements).
Generate and document packaging drawings, BOM, SAP, packaging instructions, and maintain their congruency across STX factories.
Develop/generate flexible packaging solutions and document label guides.
Responsible for supporting Marketing and secondary contract packaging sites, including documentation management and test reports as well as change approval.
About you:
Bachelor's Degree in Mechanical Engineering or Logistics/Supply Chain Management.
Efficiently multitasks, being self-driven, and paying attention to details. Understands with whom to interact to make progress (supplier contacts, factory, CMT, purchasing, supplier quality, and other engineering groups).
Fluent in English communication both spoken and written.
Ability to speak mandarin to liase with chinese suppliers.
Your experience includes:
Capability to work cross-functionally is preferred.
3D CAD modeling experience with Solidworks or similar is a must, and GD&T.
Finite element analysis experience using Ansys is a plus.
Expanded foam cushion and pallet design hands-on are preferred, and experience with thermoform, injection-molded plastic is a plus.
Package design, tooling design, and test experience, including familiarity with packaging-related ASTM and ISTA test standards, desired.
Data analysis of large datasets.
You might also have:
Knowledge of global compliance requirements and trends is an added advantage.
HDD manufacturing industry knowledge.
Familiar with plastic and expanded foam cushion materials (e.g. EPP, EPE).
Familiar with corrugated fiberboard materials and their specifications.
Knowledge/experience using electrodynamic vibration tester, accelerometers for measuring shock levels on the Lansmont Test Partner system.
Location:
About Us
With more than four decades of storage innovation, Seagate empowers humanity to thrive in the data age and helps people and businesses navigate the ever-expanding data landscape.
We craft precision-engineered, cutting-edge solutions that help the world store and manage exponential data growth.
Seagate is powered by our talented andpassionate workforce of 29,000 employees across the globe who embody our core values: integrity, innovation, and inclusion. Striving towards excellence every single day, we show up with these values for our customers, business partners, shareholders, and communities alike.
Join us and get inspired to make a difference in the datasphere!
Seagate is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, race, color, ancestry, national origin, citizenship status, physical or mental disability, genetic information, marital status, sex (which includes pregnancy, childbirth, breastfeeding, or related medical conditions), gender, gender identity, gender expression, sexual orientation, religion, military and veteran status, or other status protected by applicable law. We will consider for employment qualified applicants with arrest and conviction records. EEO Know Your Rights Poster
Seagate will provide reasonable accommodationwith the application process upon request as required to comply with applicable laws. If you need assistance oraccommodation due to a disability, you may contact us at
All Seagate jobs will remain open for a minimum of seven days.
For information on how Seagate collects and uses your personal information during the application process, please review the Applicant Privacy Statement .
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Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A LAB Process Engineer is responsible for developing, optimizing, and maintaining
laser bonding processes —especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities
Process Development & Optimization:
Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
Scale-Up & Qualification:
Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
Equipment & Program Management:
Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
Troubleshooting & Support:
Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
Continuous Improvement:
Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
Documentation:
Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
Cross-Functional Collaboration:
Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
Safety & Compliance:
Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
Customer & Project Support:
Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
Laser Maintenance & Calibration (Good-to-have):
Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.
Requirements
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
Experience with
Laser Assisted bonding technologies
is highly preferred. Familiarity with laser or optical systems is necessary.
Familiarity with
bonding equipment and analytical tools
(X-ray, SAM, OM, etc.)
Familiarity with advanced process control and manufacturing best practices
Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of
bonding process and materials behaviour under thermal/mechanical stress
(e.g., CTE mismatch, flux residue, underfill cure).
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Interested applicants, WA your resume to or email your resume to
TAN YEN ZHEN (CHEN YANZHEN) REG NO: R
THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C727
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Position title : Laser-Assisted Bonder (LAB) process engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Overview

A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes —especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.

Key Responsibilities

• Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
• Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
• Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
• Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
• Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
• Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
• Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
• Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
• Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
• Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Familiarity with advanced process control and manufacturing best practices
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to ‪‪ ‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C727

Laser-Assisted Bonder (LAB) process engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours: 9:00am - 6:00pm
Salary: $6000 - $8000 (depends experience)
Overview
A LAB Process Engineer is responsible for developing, optimizing, and maintaining laser bonding processes—especially in high-precision, high-reliability Advanced Packaging application for Chip-to-Wafer or Chip-to-Substrate bonding.
Key Responsibilities
Process Development & Optimization: Develop, implement, and optimize laser-assisted bonding processes for product packaging, advanced interconnects, or micro-assembly, including recipe creation and parameter optimization to achieve maximum yield, quality, and throughput.
Scale-Up & Qualification: Qualify new laser bonding processes from R&D to high-volume production, working with both development and production teams.
Equipment & Program Management: Specify, program, and refine laser bonder equipment and processes, ensuring the right hardware and software configurations for various substrates and products.
Troubleshooting & Support: Troubleshoot laser systems and bonding processes; analyze and resolve yield, quality, and reliability issues in collaboration with operators and maintenance teams.
Continuous Improvement: Lead initiatives to improve yield, cycle time, and cost—using data-driven methodologies such as SPC, DOE, and Six Sigma tools (like PFMEA).
Documentation: Maintain accurate records of process parameters, recipes, standard operating procedures (SOPs), and results for compliance and technology transfer.
Cross-Functional Collaboration: Work closely with R&D, operations, maintenance, and quality teams; provide technical training and support for process implementation and equipment operation.
Safety & Compliance: Ensure adherence to laser safety regulations and best practices in a laboratory or production environment.
Customer & Project Support: Provide technical insights and support for customer programs, NPI (new product introduction), and technology upgrades as needed
Laser Maintenance & Calibration (Good-to-have): Perform regular maintenance, alignment, and calibration of laser bonder equipment to ensure optimal performance and process reliability. Develop preventive maintenance schedules and conduct root-cause analysis for equipment issues.
Requirements
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
Experience with Laser Assisted bonding technologies is highly preferred. Familiarity with laser or optical systems is necessary.
Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
Familiarity with advanced process control and manufacturing best practices
Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Chaw Chiaw Han, Reg No:R
The Supreme HR Advisory Pte Ltd, EA No:14c7279
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Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
• Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
• Oversee fabrication of prototype modules and their integration with TCB platforms.
• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
• Collaborate with Electrical, Vision and Software Engineers for the machine integration.
• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
• Document all designs, simulations, and test results according to quality management and IP standards.
• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
• Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to ‪‪ ‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279

Overview
Canonical is a leading provider of open source software and operating systems to the global enterprise and technology markets. Our platform, Ubuntu, is widely used in breakthrough enterprise initiatives such as public cloud, data science, AI, engineering innovation and IoT. Our customers include the worlds leading public cloud and silicon providers, and industry leaders in many sectors. The company is a pioneer of global distributed collaboration, with 1200+ colleagues in 75+ countries and very few office-based roles. Teams meet two to four times yearly in person, in interesting locations around the world, to align on strategy and execution. The company is founder-led, profitable, and growing.
We are hiring talented
Software Engineers
with strong
Python, Packaging and Linux skills
and who want to have a positive impact on the day-to-day workflow of thousands of snap, rock and charm publishers. To be successful on this team youll need to be interested in packaging formats, build systems and automation that can simplify the lives of developers and engineers trying to ship software to the widest possible audience.
We design and maintain specialist Python tools to support the developer build and publication process. The team takes responsibility for tooling that builds snaps, charms and more recently, rocks. Snapcraft allows developers to deliver app updates to millions of Linux systems automatically, eliminating the long tail of supported releases and complex install instructions. Snapcraft enables thousands of applications from over a thousand developers, including Spotify, Slack, and Microsoft. Likewise, Charmcraft enables collaboration between charmed operator developers, and publication on Charmhub, home of the Charmed Operator Collection. Charmed Operators enable developers to package software like databases, event queues, caches, observability tools, identity tools and more, right alongside the operations code that enables teams to integrate and operate that software at scale from Day 0 to Day 1,000, and beyond. And Rockcraft provides the means for container developers to build production-grade Ubuntu-based container images, regardless of their experience as a software developer. These container images are called Rocks and can be found in various popular container registries, like Docker Hub, offering an opinionated and consistent design that focus on security while providing a homogeneous user experience across all rocks.
What we are looking for in you
You have expertise in Python.
You have a strong understanding of the makeup of a modern GNU/Linux distribution.
You have a good understanding of build systems and toolchains, including for cross-compilation.
Experience working with container technology, such as Docker, Kubernetes and LXD.
Use your familiarity with languages, toolchains, frameworks, integrations, and CI systems to extend the snap build ecosystem.
Work with external open source and commercial projects to understand how we can better serve community needs.
What we offer you
Your base pay will depend on various factors including your geographical location, level of experience, knowledge and skills. In addition to the benefits above, certain roles are also eligible for additional benefits and rewards including annual bonuses and sales incentives based on revenue or utilisation. Our compensation philosophy is to ensure equity right across our global workforce.
In addition to a competitive base pay, we provide all team members with additional benefits, which reflect our values and ideals. Please note that additional benefits may apply depending on the work location and, for more information on these, you can ask in the later stages of the recruitment process.
Fully remote working environment - we've been working remotely since 2004!
Personal learning and development budget of 2,000 USD per annum
Annual compensation review
Recognition rewards
Annual holiday leave
Parental Leave
Employee Assistance Programme
Opportunity to travel to new locations to meet colleagues at sprints
Priority Pass for travel and travel upgrades for long haul company events
About Canonical
Canonical is a pioneering tech firm at the forefront of the global move to open source. As the company that publishes Ubuntu, one of the most important open-source projects and the platform for AI, IoT, and the cloud, we are changing the world of software. We recruit on a global basis and set a very high standard for people joining the company. We expect excellence; in order to succeed, we need to be the best at what we do. Most colleagues at Canonical have worked from home since our inception in 2004. Working here is a step into the future and will challenge you to think differently, work smarter, learn new skills, and raise your game.
Canonical is an equal opportunity employer. We are proud to foster a workplace free from discrimination. Diversity of experience, perspectives, and background create a better work environment and better products. Whatever your identity, we will give your application fair consideration.
Seniority level
Entry level
Employment type
Full-time
Job function
Engineering and Information Technology
Industries
Software Development
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Position title : TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Responsibilities
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
Required Skills and Qualifications
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
Experience with TCB or Laser Assisted bonding technologies is highly preferred.
Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.).
Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus.
Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus.
End of description.
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Job Description

As a Process Integration Principal/ Staff Engineer, be part of an exciting research and development team to work on cutting-edge Advanced Packaging process technologies. In this role you will develop integrated process modules to enable advanced packaging process technologies for Mobile, IoT, Consumer and High-Performance Computing market segment. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions bringing them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and integration process flow development to make sure projects are completed successfully and delivered on time.

Responsibilities:

• Develop 2.5D/ 3D process technologies and solutions for Advanced Packaging including Bump/ Re-Distribution Layer, Through-Silicon Via, Backside Via Reveal, Hybrid Bonding
• Plan wafer splits/ lot run with design of experiment methodology for co-optimization of unit process to enable overall successful integrated module development.
• Process and manage wafers/ lots through integrated lines/ process flow and collect metrology data to ensure meeting requirements such as yield, reliability.
• Collect on-wafer data, perform data analysis, and provide outcome, learnings and plan for the next process steps.
• Owns, manage, and drive technical programs/ project, report out timely status and interface with various stakeholders/management leading to completion.

Experience:

• Around 10 years of hands-on experience, deep knowledge in semiconductor technology and processing in cleanroom environment either: Front-end of Line/ Back-end of Line/ Packaging or Assembly.
• Knowledge of Advanced Packaging architecture and process flow such as flip-chip, Through-Silicon Via, Re-Distribution Layer, Singulation, Hybrid Bonding, assemblies, reconstitution, etc will be advantageous.
• Hands-on Experience in Unit Processes BEOL & Packaging Assembly Unit Process (e.g. Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.) will be advantageous.
• Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies.
• Demonstrate ability and experience to work, solve complex problems and drive projects to end goals completions.
• Demonstrate ability, experience, and good communication skills to work across different functions/ unit process owners and geographies to achieve technical outcome.
• Bachelor, Master, Doctorate in STEM disciplines e.g. Physics, Chemistry, Electrical, Mechanical, or Materials Science Engineering.

Work Location:

• Science Park II

Job Description
Collaborate on chip architecture: Work closely with the front-end design team to develop comprehensive chip floorplans, clock architectures, and power plans.
Lead physical design processes: Take charge of the entire physical design lifecycle, from Netlist to GDSII, ensuring high-quality outcomes at every stage.
Ensure design integrity: Conduct formal verification, static timing analysis, and physical verification to maintain the highest standards of chip design.
Optimize power consumption: Perform power analysis and implement design strategies for improved efficiency and reliability.
Drive project completion: Oversee the tapeout process, bringing designs from concept to reality.
Job Requirement
Bachelor's degree or higher in electronic engineering, microelectronics, or computer science.
Professionals with at least 3 years of hands-on experience in digital backend design, preferably with tapeout experience in advanced technology.
Individuals skilled in TCL, Perl, or Python script development, and familiar with EDA tool design will have an advantage.
HOW TO APPLY:
Interested applicants, kindly send your resume in MS WORD format to leo.tang(at)trustrecruit.com.sg
We regret only shortlisted candidates will be notified.
Important Note: Trust Recruit Pte Ltd is committed to safeguarding your personal data in accordance with the Personal Data Protection Act (PDPA).
Please read our privacy statement on our corporate website
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EA Personnel: Tang For Farn (Leo)
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