455 Packaging Design jobs in Singapore

This position offers a unique opportunity to work with a prominent technology solutions provider renowned for its cutting-edge innovations in high-precision engineering and advanced packaging systems.

The successful candidate will be responsible for developing precision modules used in advanced packaging applications, influencing critical aspects of semiconductor equipment design from concept through to production within a fast-paced and innovation-driven environment.

The role involves translating application and performance requirements into robust mechanical design concepts and detailed specifications. Conducting force analysis, vibration modeling, thermal simulations, and lifespan estimations to evaluate and optimize design integrity is also key.

Additionally, the Precision Engineer will develop and compare multiple design options, balancing performance, cost-efficiency, and manufacturability. Selecting appropriate materials that meet reliability standards and are compatible with cleanroom manufacturing and semiconductor processes is crucial.

The job requires creating detailed 3D models and performing structural assessments using simulation tools. Working closely with process, manufacturing, and test engineering teams to ensure smooth design transfer and manufacturability is essential.

The ideal candidate will have a strong grasp of mechanical fundamentals, including stress analysis, thermal behavior, and motion precision. Effective problem-solving skills and the ability to manage multiple design iterations in a dynamic environment are necessary.

• Bachelor's degree or higher in Mechanical Engineering or a closely related discipline
• Proven experience in mechanical design, ideally within the semiconductor or precision equipment domain
• Proficient in 3D CAD tools such as Solid Edge, SolidWorks, Pro-E, or AutoCAD
• Strong understanding of mechanical principles, including mechanics, thermodynamics, and materials science

This role provides an exciting opportunity for individuals with a passion for precision engineering and a drive to contribute to the development of innovative technologies.

A competitive compensation package will be offered to the selected candidate, reflecting their value to the organization.

Please submit your updated resume today, quoting reference number A, if you are interested in this role.

Only shortlisted candidates will be notified.

Position title : TCB (Thermo Compression Bonding) Design Engineer / Advanced Packaging Design Engineer (TCB / Equipment Design)

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
  Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
  Oversee fabrication of prototype modules and their integration with TCB platforms.
  Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
  Collaborate with Electrical, Vision and Software Engineers for the machine integration.
  Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
  Document all designs, simulations, and test results according to quality management and IP standards.
  Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
  Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
  Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested Personal kindly contact WhatsApp :+65 8833 7969(Lydia)

OR

Email to :

The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development

• Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

• Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).

• Planning, Scheduling and Costing of Machines Modules.

• Prototyping & Testing

• Oversee fabrication of prototype modules and their integration with TCB platforms.

• Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.

• Process & Manufacturing Support

• Collaborate with Electrical, Vision and Software Engineers for the machine integration.

• Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)

• Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.

• Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

• Compliance & Documentation

• Document all designs, simulations, and test results according to quality management and IP standards.

• Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis

• Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.

• Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.

• Ensure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.

• Experience with TCB or Laser Assisted bonding technologies is highly preferred.

• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

• Excellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).

• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).

• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.

• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to +65 9136 9792 or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279

Position title : TCB (Thermo Compression Bonding) Design Engineer / Semiconductor Packaging Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
  Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
  Oversee fabrication of prototype modules and their integration with TCB platforms.
  Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
  Collaborate with Electrical, Vision and Software Engineers for the machine integration.
  Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
  Document all designs, simulations, and test results according to quality management and IP standards.
  Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
  Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
  Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested Personal kindly contact WhatsApp :+65 8833 7969(Lydia)

OR

Email to :

The Supreme HR Advisory Pte Ltd

Reg No: R1988890

EA No: 14C7279

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street

Working Days: 5 Day A Week

Working hours : 9:00am - 6:00pm

Salary : $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development

• esign innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.

• R sponsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).

• P anning, Scheduling and Costing of Machines Modules.

• P ototyping & Testing

• O ersee fabrication of prototype modules and their integration with TCB platforms.

• A alyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.

• P ocess & Manufacturing Support

• C llaborate with Electrical, Vision and Software Engineers for the machine integration.

• C llaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)

• C llaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.

• S pport transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.

• C mpliance & Documentation

• D cument all designs, simulations, and test results according to quality management and IP standards.

• R main updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• T ermal & Mechanical Analysis

• P rform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.

• D sign and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.

• E sure safe and stable mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Required Skills and Qualifications

• B chelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.

• Minim m 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.

• 3D/ D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.

• E perience with TCB or Laser Assisted bonding technologies is highly preferred.

• F miliarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)

• E cellent trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).

• K owledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).

• E perience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.

• E perience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested applicants, WA your resume to ‪‪+65 9136 9792‬‬ or email your resume to

TAN YEN ZHEN (CHEN YANZHEN) REG NO: R25138932

THE SUPREMEHR ADVISORY PTE LTD EA NO: 14C7279

At OKX, we believe that the future will be reshaped by crypto, and ultimately contribute to every individual's freedom. OKX is a leading crypto exchange, and the developer of OKX Wallet, giving millions access to crypto trading and decentralized crypto applications (dApps). OKX is also a trusted brand by hundreds of large institutions seeking access to crypto markets. We are safe and reliable, backed by our Proof of Reserves. Across our multiple offices globally, we are united by our core principles: We Before Me, Do the Right Thing, and Get Things Done. These shared values drive our culture, shape our processes, and foster a friendly, rewarding, and diverse environment for every OK-er. OKX is part of OKG, a group that brings the value of Blockchain to users around the world, through our leading products OKX, OKX Wallet, OKLink and more.

Join us at OKX, where we're shaping the future of decentralized finance (DeFi) to make it accessible to everyone. We're seeking Product Designers to define our DeFi products, strategize, and cultivate exceptional user experiences.

As we expand our focus beyond CEX traders, we're building a world class Decentralised Platform tailored for our web3 users. Your role will involve owning transaction workflows, data display, and feature execution, crafting experiences that delight our global user base. This is your chance to have a significant impact on millions of users worldwide, collaborating with cross-functional teams to deliver top-notch DeFi experiences. If you're passionate about revolutionizing decentralised finance, join us as we Buidl cutting edge web3 products with the latest blockchain technologies.

• Synthesise needs from Product, Engineering, and Marketing into comprehensive design deliverables, ensuring design is front-of-mind throughout the product development process
• Work through design problems from beginning to end: translating research insights into ideas that form disruptive new products and features, then designing the workflows and detailed interactions to realize them
• Support the product development process with wireframes, user flows, journey maps, high-fidelity mockups, interactive prototypes, and evaluative research
• Partner with cross-functional peers within Product and Engineering in Asia and internationally to define initiatives and create thoughtful solutions—representing design and being the voice for the user throughout the product lifecycle
• Collaborate closely with UX Research, UX Writing, Brand, and Product leadership to shape the overall design vision of your area of ownership
• Consistently elevate the quality of the design by soliciting feedback from peers and stakeholders through formal Design Reviews, presentations and by facilitating design thinking workshops
• Mentor other designers throughout the organization on craft, quality, experience, and processes.
• Work with data, whether qualitative or quantitative to make informed design decisions

• At least 8 years of experience in Product Design, Interaction Design, UX Design, or related fields, with people management experience.
• Strong communication skills with a proven ability to articulate ideas and advocate for design decisions.
• Experience working with cross-functional teams, including Designers, Product Managers, Engineers, UX Writers, and Researchers.
• A deep understanding of design-critical thinking and user-centered design methodologies, ensuring products offer intuitive and trustworthy experiences.
• Results-oriented and adaptable to change.
• A thorough understanding of experimentation and research techniques, capable of validating designs independently.
• A good eye for design with a diverse portfolio of your design works throughout your career.

• Experience designing for Fintech, Investment platforms, or Crypto products
• Experience working with teams across offices and timezones
• Understanding of React framework for Front End development
• Facilitated design thinking workshops or design sprints with peers, stakeholders, and leadership

• Competitive total compensation package
• L&D programs and Education subsidy for employees' growth and development
• Various team building programs and company events
• Wellness and meal allowances
• Comprehensive healthcare schemes for employees and dependants
• More that we love to tell you along the process!

Job Description

• Synthesize needs from Product, Engineering, and Marketing into comprehensive design deliverables, ensuring design is front-of-mind throughout the product development process
• Work through design problems from beginning to end: translating qualitative or quantitative insights into ideas that form disruptive new products and features, then designing the workflows and detailed interactions to realize them
• Support the product development process with wireframes, user flows, journey maps, high-fidelity mockups, interactive prototypes, and evaluative research
• Partner with cross-functional peers within Product and Engineering in Asia and internationally to define initiatives and create thoughtful solutions—representing design and being the voice for the user throughout the product lifecycle
• Collaborate closely with UX Research, UX Writing, Brand, and Product leadership to shape the overall design vision of your area of ownership
• Consistently elevate the quality of the design by soliciting feedback from peers and stakeholders through formal Design Reviews, presentations and by facilitating design thinking workshops

Job Requirements

• At least 5 years of experience in Product Design, Interaction Design, UX Design, or related fields.
• Strong communication skills with a proven ability to articulate ideas and advocate for design decisions.
• Experience working with cross-functional teams, including Designers, Product Managers, Engineers, UX Writers, and Researchers.
• A deep understanding of design-critical thinking and user-centered design methodologies, ensuring products offer intuitive and trustworthy experiences.
• Results-oriented and adaptable to change.
• A thorough understanding of experimentation and research techniques, capable of validating designs independently.
• A good eye for design with a diverse portfolio of your design works throughout your career.
• Min Bachelor's degree in Design or equivalent practical experience
• Experience designing for Fintech, Investment platforms, or Crypto products
• Experience working with global teams across offices and timezones
• A desire to mentor cross-functional peers and evangelize for great design

CEI Reg No: R1104662

EA Licence No: 99C4599

EA Personnel: Celine Tan Si Ling

Note that only shortlisted candidates will be notified

OKX will be prioritising applicants who have a current right to work in Singapore, and do not require OKX's sponsorship of a visa. We are open to hiring for Lead/Manager to Director level.

At OKX, we believe that the future will be reshaped by Crypto, ultimately contributing to every individual's freedom. OKX began as a crypto exchange giving millions of people access to crypto trading and over time becoming among the largest platforms in the world. In recent years, we have developed one of the most connected Web3 wallets used by millions to access decentralized crypto applications (dApps). OKX is a trusted brand by hundreds of large institutions seeking access to crypto markets on a reliable platform that seamlessly connects with global banking and payments. In the last year, OKX has expanded into new markets including Australia, Brazil, Netherlands, Singapore and Turkey, with plans to launch in the US, Belgium and the UAE.

We are deeply committed to shaping a fairer, more transparent and accessible society through blockchain technology. This is why we publish proof of reserves monthly, and continue to ship new innovative security features.

Join us at OKX, where we're shaping the future of decentralized finance (DeFi) to make it accessible to everyone. We're seeking Product Designers to define our DeFi products, strategize, and cultivate exceptional user experiences.

As we expand our focus beyond CEX traders, we're building a world class Decentralised Platform tailored for our web3 users. Your role will involve owning transaction workflows, data display, and feature execution, crafting experiences that delight our global user base. This is your chance to have a significant impact on millions of users worldwide, collaborating with cross-functional teams to deliver top-notch DeFi experiences. If you're passionate about revolutionizing decentralised finance, join us as we Buidl cutting edge web3 products with the latest blockchain technologies.

Synthesise needs from Product, Engineering, and Marketing into comprehensive design deliverables, ensuring design is front-of-mind throughout the product development process

Work through design problems from beginning to end: translating research insights into ideas that form disruptive new products and features, then designing the workflows and detailed interactions to realize them

Support the product development process with wireframes, user flows, journey maps, high-fidelity mockups, interactive prototypes, and evaluative research

Partner with cross-functional peers within Product and Engineering in Asia and internationally to define initiatives and create thoughtful solutions—representing design and being the voice for the user throughout the product lifecycle

Collaborate closely with UX Research, UX Writing, Brand, and Product leadership to shape the overall design vision of your area of ownership

Consistently elevate the quality of the design by soliciting feedback from peers and stakeholders through formal Design Reviews, presentations and by facilitating design thinking workshops

Mentor other designers throughout the organization on craft, quality, experience, and processes.

Work with data, whether qualitative or quantitative to make informed design decisions

At least 8 years of experience in Product Design, Interaction Design, UX Design, or related fields, with people management experience.

Strong communication skills with a proven ability to articulate ideas and advocate for design decisions.

Experience working with cross-functional teams, including Designers, Product Managers, Engineers, UX Writers, and Researchers.

A deep understanding of design-critical thinking and user-centered design methodologies, ensuring products offer intuitive and trustworthy experiences.

Results-oriented and adaptable to change.

A thorough understanding of experimentation and research techniques, capable of validating designs independently.

• A good eye for design with a diverse portfolio of your design works throughout your career.

Experience designing for Fintech, Investment platforms, or Crypto products

Experience working with teams across offices and timezones

Understanding of React framework for Front End development

Facilitated design thinking workshops or design sprints with peers, stakeholders, and leadership

Competitive total compensation package

L&D programs and Education subsidy for employees' growth and development

Various team building programs and company events

Wellness and meal allowances

Comprehensive healthcare schemes for employees and dependants

More that we love to tell you along the process!

#LI-EW1

Mantle is a pioneering on-chain ecosystem driving the mass adoption of token-governed technologies. The Mantle Ecosystem includes:

• Mantle Network : An Ethereum Layer 2 (L2) solution and the 4th largest L2 on Ethereum by Total Value Locked (TVL). It hosts a robust network of ecosystem applications and partnerships, including Ethena, Pendle, Merchant Moe, and Catizen.

• Mantle Governance : A decentralized autonomous organization (DAO) overseeing ecosystem decisions.

• Mantle Treasury : One of the largest on-chain treasuries on Ethereum.

• mETH Protocol : A cutting-edge ETH liquid staking and restaking protocol.

With user experience as a key growth driver, Mantle strives to set high design standards for its core and partnered products. As the ecosystem expands, creating seamless, unified, and impactful design experiences becomes increasingly critical.

We are seeking an experienced Product Design Lead to spearhead Mantle’s product design team and oversee the design strategy for core ecosystem products, including the mETH Protocol , Rewards Station , and the Mantle Website .

In this role, you will lead a globally distributed team of designers, set the standard for Mantle’s design practices, and collaborate with product and marketing teams to ensure a unified, user-first design language across all touchpoints.

• Team Leadership :

  • Manage and mentor a team of three product designers, fostering a culture of collaboration and excellence.

  • Drive professional development for the design team and ensure alignment with Mantle’s goals.

• Design Strategy :

  • Develop and execute design strategies for both new and existing products.

  • Identify opportunities to improve user experiences and implement solutions effectively.

  • Collaborate closely with the Ecosystem Product Lead to devise strategies that boost product appeal, engagement, and conversion rates.

  • Partner with the communications design team to support go-to-market strategies.

• Design Consistency :

  • Unify the design language across all Mantle products to deliver a seamless and consistent user experience.

  • Advocate for and implement best practices in design systems and UX strategy.

• Stakeholder Collaboration :

  • Work cross-functionally with product, engineering, marketing, and ecosystem partners to align design efforts with business objectives.

  • Represent the product design team in discussions with internal and external stakeholders.

Required

• Proven Leadership : Minimum of 7 years of experience in product design, with at least 3 years in a leadership role.

• Crypto Expertise : Past experience in designing crypto products, with a strong understanding of blockchain technologies and user behavior.

  • Good-to-have: Candidate is a crypto native

• UX & Design Systems : Demonstrated ability to create, manage, and scale design systems and UX strategies.

• Product-First Mindset : Ability to integrate user needs with cross-functional requirements, ensuring designs align with broader product and business goals.

• Stakeholder Management : Excellent communication skills and the ability to influence and align diverse teams toward a shared vision.

Preferred

• Graphic Design Capabilities : Experience in graphic design and visual storytelling.

• Agile Work Style : Familiarity with agile processes and iterative design approaches.