216 New Product Introduction jobs in Singapore

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.

The Product Launch Specialist plays a crucial role in the successful introduction of new products into manufacturing. This position bridges the gap between design and production, ensuring that new products are launched efficiently, cost-effectively, and with high quality.

Key Responsibilities:

• Prepare work instructions (WI, OMS) and technical write-ups for production
• Liaise with the sales team and customer to highlight issues with prints or manufacturing through the supplier problem sheet (SPS)
• Liaise with suppliers and contractors on technical purchases requiring engineering review to meet requirements
• Coordinate and follow-up on engineering activities for production and new product implementation
• Provide engineering support, advice, and direction to production sections on manufacturing and testing requirements
• Work with production to review, analyze, and resolve quality issues
• Support production on productivity improvement, cost reduction, and other continuous improvement projects from time to time
• Support qualification activities including FAI
• Design and develop toolings to improve efficiency and effectiveness of manufacturing parts
• Review processes to analyze, control, and minimize deviations using statistical tools
• Follow-up on new processes to ensure they are tested and stable before and during production
• Review process timings for new products and existing production operations to ensure they are updated and current
• Initiate cost or productivity improvements projects

Requirements:

• NITEC in Mechanical Engineering or equivalent
• We are open to candidates with no experience
• Able to work under pressure with tight deadlines
• Positive attitude and ability to communicate well with all levels
• Good communication and interpersonal skills in a multi-cultural work environment
• Meticulous and detailed in job assignments
• Relevant manufacturing experience in a production environment
• Candidates with extensive experience will be considered for a senior position
• Project management skills will be advantageous

We are seeking a highly skilled NPI Engineer to join our development team. The successful candidate will be responsible for managing the new product introduction process from design phase to production stage.

• Drive the NPI processes and all related activities within the manufacturing plant, from design stage all the way to production stage.
• Collaborate with internal and external stakeholders (suppliers, customers, production, etc.) to align the product introduction process.
• Maintain up-to-date knowledge in creating and modifying BOM structure for assembly process.
• Support the continuous improvement process by identifying potential areas in the production stage that can be optimized and achieve cost reduction measures.
• Utilize the Kaizen methodology as part of the continuous improvement processes.
• Support the production process for mass-production.

The ideal candidate should possess the following qualifications:

• Bachelor's Degree or Diploma in Electronics Engineering or any related field.
• 2 to 3 years of experience in the Manufacturing sector, preferably in Electronics space.

Interested candidates who wish to apply for this position, please click on the link below.

Job Summary:

• Develop and implement effective NPI strategies to ensure seamless product launches.
• Collaborate with cross-functional teams to create and modify Bill of Materials (BOM) for assembly processes.
• Manage and maintain Shop Floor Control (SFC) systems and SAP to optimize production efficiency.
• Lead or participate in Kaizen activities to drive continuous improvement.
• Support production during mass production runs and troubleshoot any issues that may arise.

• Degree or Diploma in Engineering with a minimum of 3 years' experience in manufacturing.
• Strong problem-solving abilities and excellent project management skills.
• Capability to work independently with minimal supervision and detail-oriented with a keen eye for accuracy.

• A dynamic and collaborative work environment.
• Opportunities for professional growth and development.
• Competitive compensation and benefits package.

Responsibilities:

• Support New Product Introduction (NPI) from testing to mass production, ensuring quality standards
• Perform First Article Inspection (FAI) and compile reports (FAIR)
• Collaborate with program managers on NPI builds and engineering evaluations
• Train QC inspectors and validate equipment/processes for production handover
• Develop/update quality documentation (Work Instructions, PFMEA, Control Plans)
• Review jig designs and 2D drawings to identify issues and measurement needs

Requirements:

• Inexperienced candidates are welcome to apply
• Diploma in or Quality Management Engineering or its equivalent
• Knowledge of SPC, PFMEA, CPK, GR&R, GD&T, and Minitab
• Proactive, detail-oriented, and strong team player with excellent communication skills

Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to

EA License No: 13C6305

Reg. No.: R24121656 (CHEN JING WEI)

For candidate who applied for the advertised position is deemed to have consented to us that we may collect, use or disclose your personal information for purpose in connection with the services provided by us.

The Principal / Senior Engineer for New Product Introduction – Wafer Technology is responsible for overseeing semiconductor technology development and implementation. This role demands exceptional technical expertise to ensure the successful transition of products from concept to mass production.

• Lead NPI process from Concept to Mass Production at Foundry (especially BCD, RF-CMOS), ensure collaboration between design, engineering, and manufacturing teams to maximize semiconductor technology optimization.
• Ensure compliance with design rules and specifications while planning and evaluating silicon characterization results.
• Develop and implement robust qualification processes, including the establishment of wafer acceptance criteria and comprehensive testing protocols.
• Lead yield improvement initiatives through in-depth analysis of test data and resolution of issues encountered during the NPI process.
• Produce comprehensive reports detailing project status, potential risks, and key milestones; execute thorough risk assessments for foundry excursions and return material authorizations.
• Implement and oversee sophisticated data exchange protocols between foundry, Outsourced Semiconductor Assembly and Test (OSAT) providers, and Continental to facilitate effective yield monitoring and quality control.
• Drive continuous improvement in wafer technology processes, identifying opportunities for enhanced efficiency, cost reduction, and quality improvement.
• Develop and maintain strong relationships with key suppliers and technology partners, staying abreast of industry trends and emerging technologies in semiconductor manufacturing.

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in wafer manufacturing, process integration and/or device engineering.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.

Do more than you ever thought possible. Have more impact than you ever imagined. This is where some of the world's most passionate people create the world's most innovative products and experiences. Join us and you'll do the best work of your life — and make a difference in other people's lives. We are looking for a dynamic, experienced, and highly motivated manager to lead product launches for Apple's reseller/telco channel across APAC region.

• Lead a team of top-notch program managers to successfully launch products for Apple's indirect channel
• Create indirect channel's launch project plan in adherence with the general launch PoR; rally APAC Reseller Operations team and its key partners towards a successful launch based on the launch plan
• Prepare Apple's reseller and telco partners in APAC region to deliver an exceptional launch for Apple's end consumers by ensuring on-time landing of supply and merchandising elements without any impact to launch confidentiality
• Outline risks associated with the product launch clearly and establish a mitigation plan
• Problem solve and think through implications of each decision in detail under tight timelines
• Find opportunities proactively to improve business processes and partners' supply chain in order to deliver a better launch experience each time
• Represent APAC in global forums, push for regional priorities assertively as they pertain to Apple's greater organizational goals and strategy

• Lead Driven professional who is comfortable working in a fast-paced & dynamic environment
• Remarkable ability to manage cross-functional stakeholders across the organization with varying objectives and priorities
• Exceptional project management & analytical problem solving skills
• 8-10 years of professional experience
• Exceptional communicator (both written/verbal)

• Bachelor degree in supply chain, management, or relevant fields. MBA is a plus.
• Does not accept status quo and can drive business process improvements
• A leader who can quickly understand the intricacy of issues/requirements, develop the business case and drive a plan to resolution
• Experience and knowledge of multiple disciplines within supply chain operations
• Experienced in risk assessment and developing mitigation plans
• Ability to be "hands on" with great attention to detail and ability to handle incomplete and ambiguous information with agility and comfort

Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years’ working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years’ working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.

Ready to drive with Continental? Take the first step and fill in the online application.

Continental develops pioneering technologies and services for sustainable and connected mobility of people and their goods. Founded in 1871, the technology company offers safe, efficient, intelligent and affordable solutions for vehicles, machines, traffic and transportation. In 2024, Continental generated sales of €39.7 billion and currently employs around 190,000 people in 55 countries and markets.

The Automotive group sector comprises technologies for passive safety, brake, chassis, motion and motion control systems. Innovative solutions for assisted and automated driving, display and operating technologies, as well as audio and camera solutions for the vehicle interior, are also part of the portfolio, as is intelligent information and communication technology for the mobility services of fleet operators and commercial vehicle manufacturers. Comprehensive activities relating to connectivity technologies, vehicle electronics and high-performance computers round off the range of products and services.

Principal / Senior Engineer, New Product Introduction - IC Packaging, Technical Operations Management

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

• Lead NPI process from Concept to Mass Production at OSAT (especially QFP, BGA).
• Define and implement Package Development, Assembly and Testing for new PMIC products for Automotive.
• Identify opportunities for cost reduction in packaging materials and process optimizations while ensuring quality.
• Ensure Manufacturability and Product Ramp-Up.
• Prepare and present reports on NPI project status, risks and milestones.
• Drive Failure Analysis (FA) to identify Root Causes for issues.
• Perform Risk Assessments such as Failure Mode and Effects Analysis.
• Develop, align and monitor Qualification Process.
• Interface to Quality Department for Quality Confirmation.
• Elaborate and define Data Exchange between OSAT and Continental for Traceability, Quality. Assurance and Yield Monitoring.
• Establish Part Traceability Concepts.
• Conduct risk assessments and implement mitigation strategies

Your profile

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years’ working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years’ working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in package and assembly processes.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.

Our offer

Ready to drive with Continental? Take the first step and fill in the online application.

About us

Continental develops pioneering technologies and services for sustainable and connected mobility of people and their goods. Founded in 1871, the technology company offers safe, efficient, intelligent and affordable solutions for vehicles, machines, traffic and transportation. In 2024, Continental generated sales of €39.7 billion and currently employs around 190,000 people in 55 countries and markets.

The Automotive group sector comprises technologies for passive safety, brake, chassis, motion and motion control systems. Innovative solutions for assisted and automated driving, display and operating technologies, as well as audio and camera solutions for the vehicle interior, are also part of the portfolio, as is intelligent information and communication technology for the mobility services of fleet operators and commercial vehicle manufacturers. Comprehensive activities relating to connectivity technologies, vehicle electronics and high-performance computers round off the range of products and services.