1,336 Equipment Design jobs in Singapore

Lico Resources is partnering with a prominent technology solutions provider to develop cutting-edge innovations in high-precision engineering and advanced packaging systems.

• Translate application and performance requirements into robust mechanical design concepts and detailed specifications.
• Conduct force analysis, vibration modeling, thermal simulations, and lifespan estimations to evaluate and optimize design integrity.
• Develop and compare multiple design options, balancing performance, cost-efficiency, and manufacturability.
• Select appropriate materials that meet reliability standards and are compatible with cleanroom manufacturing and semiconductor processes.
• Design high-precision jigs, fixtures, and custom tooling to support advanced microelectronic assembly.
• Create detailed 3D models and perform structural assessments using simulation tools.
• Work in close coordination with process, manufacturing, and test engineering teams to ensure smooth design transfer and manufacturability.
• Drive continuous improvement initiatives by identifying opportunities to enhance product performance, design efficiency, and cost control.

• Bachelor's degree or higher in Mechanical Engineering or a closely related discipline.
• Proven experience in mechanical design, ideally within the semiconductor or precision equipment domain.
• Proficient in 3D CAD tools such as Solid Edge, SolidWorks, Pro-E, or AutoCAD.
• Strong grasp of mechanical fundamentals, including stress analysis, thermal behavior, and motion precision.

This role offers a unique opportunity to influence critical aspects of semiconductor equipment design and work in a fast-paced and innovation-driven environment. If you are interested in this role, please submit your updated resume for consideration.

The role of Static Equipment Lead is pivotal in the development and execution of static equipment designs for industrial projects. The responsibilities encompass reviewing technical specifications, data sheets, calculations, and deliverables to ensure precision and compliance.

• Design and engineer static equipment (e.g., pressure vessels, storage tanks, heat exchangers, boilers, furnaces) and packages (e.g., PSA, cooling towers, scrubbers, conveyors, loading arms).
• Assess vendor documents and coordinate with vendors to support inspection and quality control requirements.
• Participate in Factory Acceptance Tests, site surveys, Hazard Operability Studies, shop inspections, and provide support during construction and commissioning phases.
• Analyze opportunities to enhance work processes and contribute to the professional growth of team members.

Essential Qualifications:

• Bachelor's degree in Mechanical Engineering with at least 15 years of relevant experience.
• In-depth knowledge of ASME codes, storage tank design, boilers/furnaces, and industrial package engineering.
• Familiarity with engineering software such as PVElite and COMPRESS.
• Excellent coordination, planning, and communication skills.
• Prior experience in field engineering, commissioning, and troubleshooting is required.

This role involves working on high-precision automation and semiconductor equipment design. Key responsibilities include conducting feasibility studies, providing design specifications, and supporting design proposals.

• Conceptualize and design automation/semiconductor equipment to meet project requirements.
• Create 2D/3D AutoCAD drawings and assembly methods for efficient production.
• Perform thorough troubleshooting and testing to ensure equipment reliability.
• Collaborate with cross-functional teams to achieve project milestones and meet design specifications.

• Bachelor's Degree in Mechanical Engineering or a related field is essential.
• Minimum 5 years of experience in designing semiconductor/automation equipment is required.
• Proficiency in 3D CAD software is necessary for success in this role.

We are seeking a highly skilled CAD Design Engineer (Mechanical Equipment) to join our engineering team and support complex plant engineering projects from design to commissioning. The ideal candidate will have a strong mechanical or chemical engineering background, be proficient in 3D CAD software , and be capable of preparing technical documentation while coordinating with customers and contractors throughout the project lifecycle.

• Design and develop 3D models and 2D drawings for mechanical systems and equipment using CAD software such as CREO, Inventor, SolidWorks , or equivalent tools.
• Prepare supporting engineering documentation including Material Take-Off (MTO) , process descriptions , technical specifications , user manuals , and equipment lists .
• Ensure mechanical designs meet project requirements, safety standards, and quality specifications.
• Collaborate with cross-functional teams including process, electrical, and automation engineers during all project phases.
• Coordinate with customers and contractors to manage technical interfaces, resolve design issues, and ensure smooth execution of engineering activities.
• Support procurement and manufacturing by providing detailed design documentation and responding to RFIs.
• Participate in overseas travel and on-site commissioning activities including installation supervision, testing, and troubleshooting.

• Bachelor’s Degree in Mechanical Engineering or Chemical Engineering .
• Strong mechanical design and process engineering background with 2D/3D CAD skills (CREO, Inventor, SolidWorks, or equivalent.)
• Good understanding of mechanical equipment used in plant engineering (e.g., pumps, heat exchangers, valves, vessels).
• Excellent organizational and coordination skills to manage multiple stakeholders.
• Willingness to travel overseas for site commissioning and technical support .
• Strong communication skills and ability to work in a team-oriented, fast-paced environment.

If interested, please submit your application to with your expected salary and resume.

We regret that only short-listed candidates will be contacted shortly. By submitting your application or resume, you agree to the collection, use, retention, and sharing of your personal information with potential employers for their assessment.

JDA WMS Pte Ltd | EA Personnel: Pham Thi Tuyet Mai

EA License No: 23S1595 | EA Registration No: R

Position title : TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
  Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
  Oversee fabrication of prototype modules and their integration with TCB platforms.
  Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
  Collaborate with Electrical, Vision and Software Engineers for the machine integration.
  Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
  Document all designs, simulations, and test results according to quality management and IP standards.
  Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
  Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
  Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

WhatsApp: (Han)

Email:

Chaw Chiaw Han, Reg No：R

The Supreme HR Advisory Pte Ltd, EA No：14c7279

Position title : TCB (Thermo Compression Bonding) Design Engineer
Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:
Design & Development
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Prototyping & Testing
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
Compliance & Documentation
Document all designs, simulations, and test results according to quality management and IP standards.
Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Good-to-have:
Thermal & Mechanical Analysis
Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
Mounting of the heater assembly for micron-level Z positioning and planarity during operation.
Requirements
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
Experience with TCB or Laser Assisted bonding technologies is highly preferred.
Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
WhatsApp: (Han)
Email:
Chaw Chiaw Han, Reg No:R
The Supreme HR Advisory Pte Ltd, EA No:14c7279
#J-18808-Ljbffr

Responsibilities:

• Design and develop detailed 2D/3D models and technical documentation for plant engineering projects
• Coordinate with international teams (e.g., manufacturing partners, clients) to ensure project alignment
• Support onsite commissioning and resolve design-related challenges during execution
• Manage project deliverables like MTOs, manuals, and specifications

Requirements:

• Minimum Degree in Mechanical or Chemical Engineering
• Proficiency in 3D CAD software (CREO, Inventor, SolidWorks)
• Strong mechanical engineering foundation (physics, materials, math)
• Familiar with 3D models and 2D drawings

Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to

EA License No: 13C6305

Reg. No.: R (CHEN JING WEI)

For candidate who applied for the advertised position is deemed to have consented to us that we may collect, use or disclose your personal information for purpose in connection with the services provided by us.

Position title : TCB (Thermo Compression Bonding) Design Engineer / Advanced Packaging Design Engineer (TCB / Equipment Design)

Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)

Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development
  Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
  Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  Planning, Scheduling and Costing of Machines Modules.
• Prototyping & Testing
  Oversee fabrication of prototype modules and their integration with TCB platforms.
  Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support
  Collaborate with Electrical, Vision and Software Engineers for the machine integration.
  Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
  Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
  Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation
  Document all designs, simulations, and test results according to quality management and IP standards.
  Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis
  Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
  Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
  Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Interested Personal kindly contact WhatsApp : (Lydia)

OR

Email to :

The Supreme HR Advisory Pte Ltd

Reg No: R

EA No: 14C7279

Position title : TCB (Thermo Compression Bonding) Design Engineer / Advanced Packaging Design Engineer (TCB / Equipment Design)
Location: Admiralty Street
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $6000 - $8000 (depends experience)
Role Overview
A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.
Key Responsibilities
Must-have:
Design & Development
Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding.
Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
Planning, Scheduling and Costing of Machines Modules.
Prototyping & Testing
Oversee fabrication of prototype modules and their integration with TCB platforms.
Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
Process & Manufacturing Support
Collaborate with Electrical, Vision and Software Engineers for the machine integration.
Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls)
Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.
Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
Compliance & Documentation
Document all designs, simulations, and test results according to quality management and IP standards.
Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.
Good-to-have:
Thermal & Mechanical Analysis
Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage.
Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity.
Mounting of the heater assembly for micron-level Z positioning and planarity during operation.
Requirements
Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
Experience with TCB or Laser Assisted bonding technologies is highly preferred.
Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus
Interested Personal kindly contact WhatsApp : (Lydia)
OR
Email to :
The Supreme HR Advisory Pte Ltd
Reg No: R
EA No: 14C7279
#J-18808-Ljbffr